Zytel ® RS HTN59G55LWSF BK083

About
Zytel®RS HTN59G55LWSF BK083是一种55%的玻璃纤维增强高性能聚酰胺树脂,含有32%可重复使用的原料(71%仅基于聚合物)。为结构应用提供了低翘曲和良好尺寸稳定性。
电子电器:连接器、卷线轴、计时器、护盖断路器、开关壳座、插座、接头、垫圈等;
2、汽车:散热风扇、门把、油箱盖、进气隔栅、水箱护盖、灯座、滤油器、变速杆等;
3、工业零件:椅座、自行车输框、溜冰鞋底座、纺织梭、踏板、滑轮、电动工具等;
4、其他:电动工具、护罩、风叶、齿轮、机床附件、运动器材、玩具制品、扎带等。

Product Description
SupplierDuPont
GenericPA66
Material StatusCommercial: Active
FeaturesGood flexibility,High impact resistance,Antifreeze,Self-lubricating,Self-extinguishing,Good Tensile Strength
AvailabilitysNorth America

Technical Data
appraisalNominal valueUnitTest method
Part marking code>PA-GF55<ISO 11469
Part marking code>PA-GF55<SAE J1344

MECHANICALNominal valueUnitTest method
Fracture stress235MPaISO 527
Fracture strain2.5%ISO 527
Tensile modulus17000MPaISO 527
Bending modulus14400MPaISO 178
bending strength340MPaISO 178

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa190ISO 75-1/2

Electrical performanceNominal valueUnitTest method
Dielectric constant
1 GHz4.1E-4ASTM D2520-B
3 GHz4.1E-4ASTM D2520-B
10 GHz4.2E-4ASTM D2520-B
Dissipation factor
1 GHz125E-4ASTM D2520 B
3 GHz113E-4ASTM D2520 B
10 GHz119E-4ASTM D2520 B

IMPACTNominal valueUnitTest method
Charpy Notched Impact Strength24kJ/m²ISO 179-1eA

PHYSICALNominal valueUnitTest method
Shrinkage rate
Normal, 2.0 mm0.25%ISO 294-4
MD:2.0 mm0.05%ISO 294-4
Density1.57g/cm³ISO 1183

Process Conditions
Processing and formingNominal valueUnitTest method
Melt temperature range240-260°C
Optimal melt temperature250°C
Mold temperature range80-100°C
Optimal mold temperature90°C
Drying time, dehumidification dryer6-8h
Drying time100°C
Forming moisture content<0.10%

Notes
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