AMPLIFY™ EA 103

About
AMPLIFY™ EA 103 Functional Polymer is produced via a high-pressure reactor. This ethylene-ethyl acrylate (EEA) copolymer exhibits high flexibility and imparts low temperature toughness to a wide range of engineering resins. It can be utilized as in a hot melt adhesive formulation due to the high thermal stability it offers. It is an excellent base component for a film laminate and has marginal RF welding capability. This polymer demonstrates excellent blend compatibility with other polyolefins. It can be utilized as a tie layer between polyolefins and a variety of polar substrates, such as metal, polyvinylidiene chloride (PVDC), polyolefins, cellulose, polyester, polycarbonate, glass, foil, PVC, PET, and Polystyrene. High performance packaging applications High flow concentrate carrier Adhesive blend component Tie layer to PVDC and Polyolefins Excellent thermal stability Complies with U.S. FDA 21 CFR 175.105 U.S. FDA 21 CFR 177.1320 (with Restrictions) EU, No 10/2011 Consult the regulations for complete details.&&

Product Description
SupplierDOW
GenericEEA
Material StatusCommercial: Active
AvailabilitysNorth America,Latin America,Asia Pacific

Technical Data
IMPACTNominal valueUnitTest method
Tensile impact strength504kJ/m²ASTM D1822

MECHANICALNominal valueUnitTest method
Shore hardness 
Shaw’s D27ASTM D2240 , ISO 868
Shaw’s A82 ASTM D2240 , ISO 868
tensile strength ASTM D638 , ISO 527-2
yield2.59MPaASTM D638 , ISO 527-2
fracture9.65MPaASTM D638 , ISO 527-2
Tensile strain ASTM D638 , ISO 527-2
yield11%ASTM D638 , ISO 527-2
fracture750%ASTM D638 , ISO 527-2
Bending modulus
2% secant42.7MPaASTM D790B , ISO 178

PHYSICALNominal valueUnitTest method
Density0.930g/cm³ASTM D792 , ISO 1183
Melt Flow Rate
190℃,2.16kg21g/10minASTM D1238,ISO 1133
Co monomer content19.5%ASTM D3594

THERMALNominal valueUnitTest method
Hot deformation temperature
0.45 MPa, unannealed31.1ASTM D648
Embrittlement temperature-63.9ASTM D746
Vicat Softening Temp48.9ASTM D1525 , ISO 306
Melting temperature
DSC95.0Internal Method
Crystallization peak temperature
DSC77.8Internal Method

Notes
1. Typical properties: these are not to be construed as specifications.
2. Smaller Die opening is used for products greater than 10 MI
3. Calibration Range is 15 – 20% EA; Pathlength is normalized; Plaque/Film Thickness is 15 mil; Press Temperature is 160°C
4. Type S
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