About |
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HCG2510MP is high rigidity and high tenacity 10%GF PC resin. It has high stability and super shape resistance property. HCG2510MP is mainly used in mobile phone housing, etc.&& |
Product Description | |
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Supplier | KumhoSunny |
Generic | Polycarbonate |
Material Status | Commercial: Active |
Features | Good Rigidity,Good stability |
Availabilitys | Asia Pacific |
Process Methods | Injection Molding |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.25 | g/cm³ | ASTM D792 |
Melt Flow Rate | |||
300℃,1.20kg | 20 | g/10min | ASTM D1238 |
Shrinkage rate | |||
MD | 0.20 to 0.40 | % | ASTM D955 |
MECHANICAL | Nominal value | Unit | Test method |
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tensile strength | 59.0 | MPa | ASTM D638 |
Tensile strain | |||
fracture | 9.0 | % | ASTM D638 |
Bending modulus | 3250 | MPa | ASTM D790 |
bending strength | 98.0 | MPa | ASTM D790 |
IMPACT | Nominal value | Unit | Test method |
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Impact strength of cantilever beam notch | |||
3.2mm | 140 | J/m | ASTM D256 |
THERMAL | Nominal value | Unit | Test method |
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Hot deformation temperature | |||
1.8 MPa, unannealed | 135 | ℃ | ASTM D648 |
Electrical performance | Nominal value | Unit | Test method |
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Surface resistivity | > 1.0E+15 | ohms | IEC 60093 |
Volume resistivity | > 1.0E+15 | ohms·cm | IEC 60093 |
Process Conditions | |||
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injection | Nominal value | Unit | Test method |
Drying temperature | 100 to 120 | °C | |
Drying time | 3.0 to 4.0 | hr | |
Recommended maximum moisture content | 0.020 | % | |
Barrel rear temperature | 250 to 270 | °C | |
Barrel middle temperature | 260 to 280 | °C | |
Barrel front temperature | 280 to 300 | °C | |
Nozzle temperature | 280 to 290 | °C | |
Processing (melt) temperature | 290 to 300 | °C | |
Mold temperature | 100 to 140 | °C | |
Back pressure | 0.300 to 1.00 | MPa | |
Screw speed | 20 to 100 | rpm |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
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