Plaskon LS-16

About
This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesExcellent Processability,Conductive,Low Viscosity,Quick molding cycle,Fast Cure,V-0
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density1.83g/cm³ASTM D792

MECHANICALNominal valueUnitTest method
Bending modulus1.17MPaASTM D790
bending strength0.0110MPaASTM D790

THERMALNominal valueUnitTest method
Glass transition temperature152ASTM E1356
Linear coefficient of thermal expansion
MD1.7E-51/℃ASTM D696

Electrical performanceNominal valueUnitTest method
Volume resistivity9.5E+15ohms·cmASTM D257
Dielectric strength16kV/mmASTM D149
Dielectric constant
1 kHz3.30 ASTM D150
Dissipation factor
1 kHz3.0E-3 ASTM D150
Arc resistance180secASTM D495

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
Extreme oxygen index30%ASTM D2863

Notes
1. Typical properties: these are not to be construed as specifications.
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