| About |
|---|
| ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired. After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces. This adhesive film is also available in a low temperature cure version.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| Electrical performance | Nominal value | Unit | Test method |
| Volume resistivity | 5.0E+12 | ohms·cm | Internal Method |
| Dielectric strength | 39 | kV/mm | Internal Method |
| Dielectric constant | |||
| 1 kHz | 7.00 | Internal Method | |
| Dissipation factor | |||
| 1 kHz | 0.017 | Internal Method | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Carrier | Glass fiber | ||
| lap shear strength | Internal Method | ||
| Al to Al：25℃ | 11.0 | MPa | Internal Method |
| Au to Au：25℃ | 11.0 | MPa | Internal Method |
| Heating reduction | |||
| 300℃ | 0.71 | % | Internal Method |
| Working period | |||
| 25℃ | 3.0 | month | Internal Method |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| < 50℃ | 1.5E-4 | cm/cm/℃ | Internal Method |
| > 50℃ | 4.0E-4 | cm/cm/℃ | Internal Method |
| Glass transition temperature | 50.0 | ℃ | Internal Method |
| Linear coefficient of thermal expansion | |||
| MD | Internal Method | ||
| Thermal conductivity coefficient | |||
| 121℃ | 0.30 | W/m/K | Internal Method |
| storage stability | |||
| 23℃ | 120000 | min | |
| Storage period | |||
| -40℃ | 52 | wk | |
| stripping time | |||
| 125℃ | 120 | min | |
| 150℃ | 30 | min | |
| Post curing time | |||
| 125℃ | 2.0 | hr | |
| 150℃ | 0.50 | hr |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. TMA penetration mode |
| 3. C-MATIC conductance tester |
| 4. 4-point probe |
| 5. AC/DC breakdown, leakage and ionization tester |
| 6. Precision digibridge |
| 7. Thermogravimetric Analyzer |
| 8. 25% increase in viscosity @ RT |
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