CONAP® CE-1170

About
CONAP CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. CONAP CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the u ltimate in humidity resistance and hydrolytic stability while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions. Components may be removed by heating the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultraviolet light.&&

About

CONAP CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. CONAP CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the u ltimate in humidity resistance and hydrolytic stability while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions. Components may be removed by heating the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultraviolet light.&&

Product Description
Supplier	Cytec Industries
Generic	SMMA
Material Status	Commercial: Negative
Features	Good flexibility,Good Electrical Properties,Hydrolysis stability,Antimicrobial properties,Halogen free,Moisture resistance
Availabilitys	North America

Technical Data
PHYSICAL	Nominal value	Unit	Test method
Density	0.948	g/cm³
Solid content	31	%
viscosity
25℃	0.4	Pa·s	Brookfield

Electrical performance	Nominal value	Unit
Volume resistivity
25 ℃	2.0E+15	ohms·cm
Dielectric strength	> 120	kV/mm
Dielectric constant
25 ℃，100 Hz	2.50 to 3.00
Dissipation factor
25℃，100 Hz	0.010
insulation resistance
25℃	> 1.5E+16	ohms

FLAME CHARACTERISTICS	Nominal value	Unit	Test method
Flame Resistance	Self-extinguishing
flash point	13	℃

THERMAL	Nominal value	Unit	Test method
Storage period
25℃	78	wk

Supplementary information	Nominal value	Unit	Test method
Antifungal activity	Non-nutrient		ASTM G21

Notes
1. Typical properties: these are not to be construed as specifications.
2. Initially and 50% R.H.
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