| About |
|---|
| Selenis Bondz BO 035 is a copolyester specifically designed for sealing layers in BOPET films. Selenis has developed this bonding solution to consistently deliver excellent melt strength and exceptional heat-sealing performance. This product is formulated to provide and sustain the adhesion level crucial to the packaging integrity through the different processes of manufacturing, securing full protection of the final product. Selenis Bondz BO 035 greatly improves your converting steps, such as laminating, metalizing and printing. Selenis Bondz BO 035 is a crystallised copolyester resin that is easy to process even on single-screw extruders. Selenis Bondz BO 035 must be dried at the same temperatures as crystalline polyesters.&& |
| Product Description | |
|---|---|
| Generic | PCTG |
| Material Status | Commercial: Active |
| Features | Good heat sealing,Renewable resources,Crystal,Food contact compliance,Good bond,Good melt strength |
| Availabilitys | North America,Latin America,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | > 1.39 | g/cm³ | ASTM D792 |
| Apparent density | 0.84 | g/cm³ | |
| Intrinsic viscosity | 0.84 to 0.88 | dl/g | ISO 1628-5 |
| Acetaldehyde | < 1.0 | ppm | ASTM F2013 |
| Color b | < 0.00 | ASTM D6290 | |
| Color L | > 85.0 | ASTM D6290 | |
| Crystallinity | > 48.0 | ASTM D1505 | |
| Particle Shape | Cylindrical | ||
| Particle size | 270 to 370 | mg/20 chips | |
| humidity | < 0.20 | % | |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Melting peak temperature | 225 to 235 | ℃ | ASTM D3418 |
| Process Conditions | |||
|---|---|---|---|
| Extrusion | Nominal value | Unit | Test method |
| Drying temperature | 150 | °C | |
| Drying time | 4.0 to 6.0 | hr | |
| Recommended maximum moisture content | 4.0E-3 | % | |
| Melt temperature | 265 to 275 | °C | |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Crystalline |
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