EPO-TEK® 301-2FL

About
EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesHigh impact resistance,Biocompatible,Good bond,Nontoxicity
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Ionic type 
Cl-105ppm
K+19ppm
Na+58ppm
NH4+8ppm

optical performanceNominal valueUnitTest method
Refractive index 
589 nm1.510
Transmittance 
400-1000 nm> 99.0%
1000-1600 nm> 97.0%

Supplementary informationNominal valueUnitTest method
Degradation Temperature325TGA
Die Shear Strength(>10 kg,23℃)23.4MPa
working temperature
Intermittent< 250
Storage Modulus1.05GPa
Heating reduction 
200℃0.50%
250℃0.96%
300℃3.5%

Uncured PropertiesNominal valueUnitTest method
colour 
Clear/Transparent 
Density 
Part B0.888g/cm³
Part A1.06g/cm³
viscosity
23℃0.10 to 0.20Pa·s
Curing time
80℃3.0hr
storage stability600min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D70 
lap shear strength
23℃> 13.8MPa
Relative permittivity
1 kHz3.54 
Volume resistivity> 6.0E+11ohms·cm
Dissipation factor
1 kHz0.013 

THERMALNominal valueUnitTest method
5.6E-5cm/cm/℃
2.1E-4cm/cm/℃
Glass transition temperature> 45.0
Linear coefficient of thermal expansion
MD 
Thermosetting components 
Component A按重量计算的混合比: 100 
Component B按重量计算的混合比: 35 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 589 nm
6. Part B
7. Part A
8. 100 rpm
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