| About |
|---|
| TECAPEEK CMF has been developed with demanding semiconductor back end testing applications in mind. Because of the often intricate designs necessary for parts such as test sockets, TECAPEEK CMF has been designed with ceramic fillers to be very dimensionally stable and machinable. It resists the formation of burrs during machining, and does not absorb moisture, allowing for accurate and precise dimensions of even the smallest geometries without the necessity of secondary de-burring operations. TECAPEEK CMF is also stable over a range of temperatures while maintaining good mechanical strength and stiffness. TECAPEEK CMF offers a property profile well suited to semiconductor back end test applications such as test sockets. The material exhibits surface hardness and inherent toughness along with dimensional stability and machinability. Excellent machinability with low burr formation even in the smallest dimensions Minimal CLTE resulting in good dimensional stability over a wide temperature range Very low moisture absorption Good mechanical strength and stiffness even at high temperatures minimizing downtime Tough enough to prevent material cracks even with minimal wall thicknesses&& |
| Product Description | |
|---|---|
| Supplier | Ensinger |
| Generic | PEEK |
| Material Status | Commercial: Active |
| Features | Good Rigidity,Good Dimensional Stability,Machinable,Low moisture absorption,Heat Stabilized |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.63 | g/cm³ | ASTM D792 |
| Water absorption rate | |||
| 23℃，24hr | 0.060 | % | ASTM D570 |
| IMPACT | Nominal value | Unit | Test method |
|---|---|---|---|
| Impact strength of cantilever beam notch | |||
| 23℃ | 35 | J/m | ASTM D256 |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Hot deformation temperature | |||
| 0.45 MPa, unannealed | 288 | ℃ | |
| 1.8 MPa, unannealed | 300 | ℃ | |
| Melting temperature | 339 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | 5.4E-5 | 1/℃ | ASTM D696 |
| Thermal conductivity coefficient | 0.37 | W/m/K | ASTM C177 |
| Operating temperature | |||
| Intermittent | 260 | ℃ | |
| long-term | 260 | ℃ |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | 5.2E+15 | ohms | ASTM D257 |
| Volume resistivity | 3.5E+15 | ohms·cm | ASTM D257 |
| Dielectric strength | 6.6 | kV/mm | ASTM D149 |
| Dielectric constant | |||
| 23 ℃，60 Hz | 4.71 | ASTM D150 | |
| Dissipation factor | |||
| 23℃，60 Hz | 3.2E-3 | ASTM D150 |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| Flame retardant level | V-0 | UL 94 |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Rockwell hardness | |||
| M-level | 102 | ASTM D785 | |
| Tensile modulus | |||
| 23℃ | 8460 | MPa | ASTM D638 |
| tensile strength | |||
| Yield, 23 ℃ | 97.4 | MPa | |
| Fracture, 23 ℃ | 105 | MPa | |
| Tensile strain | |||
| Yield, 23 ℃ | 3.0 | % | |
| Fracture, 23 ℃ | 4.9 | % | |
| Bending modulus | |||
| 23℃ | 5400 | MPa | ASTM D790 |
| bending strength | |||
| 23℃ | 163 | MPa | ASTM D790 |
| Compression modulus | 2310 | MPa | ASTM D695 |
| compressive strength | |||
| 10% strain, 23 ℃ | 143 | MPa | ASTM D695 |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. 50% RH |
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