| About |
|---|
| EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging.&& |
| Product Description | |
|---|---|
| Generic | PI |
| Material Status | Commercial: Active |
| Features | Conductive,Thixotropic,High Heat Resistance,Thermal conductivity |
| Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 20.0 | µm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 379 | ℃ | TGA |
| Die Shear Strength（>4 kg，23℃） | 9.38 | MPa | |
| working temperature | |||
| Continuous | -55 to 225 | ℃ | |
| Intermittent | -55 to 325 | ℃ | |
| Storage Modulus（23℃） | 4.41 | GPa | |
| Thixotropic index | 1.80 | ||
| Heating reduction | |||
| 200℃ | 0.080 | % | |
| 250℃ | 0.090 | % | |
| 300℃ | 0.16 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | Silver | ||
| Density | 2.43 | g/cm³ | |
| viscosity | |||
| 23℃ | 6.5 to 11 | Pa·s | |
| Curing time | |||
| 80℃ | < 0.50 | hr | |
| 150℃ | 1.0 | hr |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 71 | ||
| Volume resistivity | |||
| 23℃ | < 5.0E-4 | ohms·cm |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| — | 2.8E-5 | cm/cm/℃ | |
| — | 5.7E-5 | cm/cm/℃ | |
| Glass transition temperature | > 100 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | > 2.8 | W/m/K | |
| Storage period | |||
| 23℃ | 52 | wk | |
| Post curing time | |||
| 285℃ | 1.5 | hr | |
| drying time | 7.0 | day |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Ramp 40°C/Min to 300°C |
| 3. Below Tg |
| 4. Above Tg |
| 5. 20 rpm |
| 6. Pre-Bake |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |