| About |
|---|
| Huawei KL-G800H epoxy molding compound is suitable for thin leaded package without any flame retardant.. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Low Viscosity,Good bond,Baking |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.97 | g/cm³ | |
| Spiral flow length | 115 | cm | |
| Shrinkage rate | |||
| MD | 0.18 | % | |
| Water absorption rate | |||
| 85℃，7days，85% RH | 0.28 | % | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Bending modulus | |||
| 25℃ | 16200 | MPa | |
| bending strength | |||
| 25℃ | 137 | MPa |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Volume resistivity | |||
| 25 ℃ | 8.0E+15 | ohms·cm |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| Flame retardant level | |||
| 3.20 mm | V-0 | UL 94 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Extractable ion content | |||
| Chloride | 9 | ppm | |
| Sodium | 3 | ppm |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Curing time | |||
| 175℃ | 0.019 to 0.025 | hr | |
| 175℃ | 0.019 to 0.033 | hr | |
| Gelation time | |||
| 175℃ | 0.47 | min | |
| Storage period | |||
| 5℃ | 6 | month |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| < 125℃ | 7.5E-6 | cm/cm/℃ | |
| > 125℃ | 3.3E-5 | cm/cm/℃ | |
| Glass transition temperature | 125 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | 0.85 | W/m/K | |
| Post curing time | |||
| 175℃ | 4.0 to 6.0 | hr |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Melt Temperature: 347°F |
| 3. Automold |
| 4. Conventional mold |
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