Devcon HV Tile Adhesive

About
High-strength towelable adhesive compound designed for bonding ceramic tile to vertical, curved and overhead surfaces and repariing ceramic tile surfaces. Intended Use: Bonding ceramic tle to vertical, curved and overhead surfaces. Product Features: Non-sagging adhesive that will support 4 lbs. per square foot while curing Fills gaps and joints in crushers prior to pouring backing compounds Excellent adhesion to metal, ceramic and concrete Easy to use 1:1 formula&&

Product Description
SupplierDevcon
Generic环氧树脂
Material StatusCommercial: Active
FeaturesGood Rigidity,Good bond
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Specific volume0.686cm³/g
Density1.40g/cm³
Shrinkage rate
MD0.10%ASTM D2566
Solid content
by Volume100%

Electrical performanceNominal valueUnitTest method
Dielectric strength13kV/mmASTM D149
Dielectric constant45.0 ASTM D150

Supplementary informationNominal valueUnitTest method
Heat resistant temperature93
Tensile shear strength12.6MPaASTM D1002

Uncured PropertiesNominal valueUnitTest method
Curing time8.0hr

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D81 ASTM D2240
Tensile modulus5520MPaASTM D638
bending strength37.2MPaASTM D790
compressive strength81.4MPaASTM D695

THERMALNominal valueUnitTest method
Linear coefficient of thermal expansion
MD2.5E-51/℃ASTM D696
Thermal conductivity coefficient0.52W/m/KASTM C177
Thermosetting components 
Component A按容量计算的混合比: 1.0 按重量计算的混合比: 1.1 
Component B按容量计算的混合比: 1.0 按重量计算的混合比: 1.0 
storage stability
24 ℃35min

Notes
1. Typical properties: these are not to be construed as specifications.
2. Cured
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