XYCOMP® Composite 1000-03

About
Greene, Tweed offers precision plastics components for a variety of demanding, semiconductor applications. These components are made from a full range of high-performance thermoplastic materials, including our Xycomp® composite materials. Xycomp is ideally suited to replace metal or ceramic compounds due to its high strength, low weight, corrosion resistance and dimensional stability. Xycomp materials may also be used in high-pressure and high-temperature (up to 250°C/482°F) applications. The optimal Xycomp material for a specific application is determined by the unique combination of plastic materials, fibers and fiber orientation, as well as manufacturing techniques. Greene, Tweed provides the necessary application evaluation services to assist in choosing the best performance characteristics.&&

About

Greene, Tweed offers precision plastics components for a variety of demanding, semiconductor applications. These components are made from a full range of high-performance thermoplastic materials, including our Xycomp® composite materials. Xycomp is ideally suited to replace metal or ceramic compounds due to its high strength, low weight, corrosion resistance and dimensional stability. Xycomp materials may also be used in high-pressure and high-temperature (up to 250°C/482°F) applications. The optimal Xycomp material for a specific application is determined by the unique combination of plastic materials, fibers and fiber orientation, as well as manufacturing techniques. Greene, Tweed provides the necessary application evaluation services to assist in choosing the best performance characteristics.&&

Product Description
Generic	PEEK
Material Status	Commercial: Active
Features	Good Rigidity,High impact resistance,Good Dimensional Stability,noise reduction,Corrosion Resistant,High Heat Resistance,Good wear resistance,Solvent resistance
Availabilitys	North America,Europe

Technical Data
PHYSICAL	Nominal value	Unit	Test method
Density	1.60	g/cm³
Water absorption rate
24hr	1.0E-3	%	ASTM D570

THERMAL	Nominal value	Unit	Test method
Glass transition temperature	143	℃	DSC
Linear coefficient of thermal expansion
MD：< 149℃	5.4E-7	1/℃	Internal Method
Operating temperature	< 250	℃	DSC

Electrical performance	Nominal value	Unit	Test method
Volume resistivity	2.2E-5	ohms·cm	ASTM D257

MECHANICAL	Nominal value	Unit	Test method
Rockwell hardness
M-level	105		ASTM D785
tensile strength
fracture	2070	MPa	ASTM D3039
Tensile strain
fracture	1.5	%	ASTM D3039
Bending modulus	124000	MPa	ASTM D790
bending strength	2000	MPa	ASTM D790
Compression modulus	124000	MPa	ASTM D3410
compressive strength	1360	MPa	ASTM D3410

Notes
1. Typical properties: these are not to be construed as specifications.
【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.

Notes

1. Typical properties: these are not to be construed as specifications.

【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.