CORFIL® 625-1

About
CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications. FEATURES & BENEFITS One-part pumpable material 250°F (121°C)/ 350°F (177°C) cure Minimal exotherm -67 to 350°F (-55 to 177°C) service range&&

Product Description
SupplierCytec Industries
Generic胶黏剂
Material StatusCommercial: Active
FeaturesLow Viscosity,Thixotropic
AvailabilitysNorth America

Technical Data
MECHANICALNominal valueUnitTest method
compressive strength
24℃20.7 to 21.4MPa
shear strength
24℃6.89 to 8.27MPa

Notes
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