| About |
|---|
| A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits. It is an increased dielectric strength of EPO-TEK® TV1002. Formerly 78-119&& |
| Product Description | |
|---|---|
| Generic | PI |
| Material Status | Commercial: Active |
| Features | High Heat Resistance,Low odor |
| Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 10.0 | µm | |
| Ionic type | |||
| Cl- | 3 | ppm | |
| K+ | 1 | ppm | |
| Na+ | 15 | ppm | |
| NH4+ | 96 | ppm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 541 | ℃ | |
| drying time | 672.0 | hr | |
| working temperature | |||
| Continuous | -55 to 300 | ℃ | |
| Intermittent | -55 to 400 | ℃ | |
| Storage Modulus（23℃） | 1.96 | GPa | |
| Thixotropic index | 1.40 | ||
| Heating reduction | |||
| 200℃ | < 0.050 | % | |
| 250℃ | < 0.050 | % | |
| 300℃ | < 0.050 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | Ivory | ||
| Density | 1.24 | g/cm³ | |
| viscosity | |||
| 23℃ | 330 to 530 | Pa·s | |
| Curing time | 2.0 | hr |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 60 |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| — | 2.8E-5 | cm/cm/℃ | |
| — | 3.6E-5 | cm/cm/℃ | |
| Glass transition temperature | > 200 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | 0.77 | W/m/K | |
| Storage period | |||
| 23℃ | 52 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Cure 150°C/1 hour + 275°C/1 hours; Ramp 20°C/min to 350°C |
| 3. Below Tg |
| 4. Above Tg |
| 5. 0.5 rpm |
| 6. 150°C/1 Hour + 275°C/1 Hour |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |