About |
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The protection sealing of a small, electronic parts is possible. Strong Points The low temperature short time of 80 C / 60min can stiffen. An internal stress is eased, and making that the warp of the substrate is small to the package is possible. Long Pot life and excellent in work. Application Small, electronic parts, substrate connections, and protection sealing in connector part.&& |
Product Description | |
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Supplier | KYOCERA |
Generic | 热固性聚酯 |
Material Status | Commercial: Active |
Availabilitys | Asia Pacific |
Process Methods | casting |
Technical Data | |||
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THERMAL | Nominal value | Unit | Test method |
Glass transition temperature | 5.00 | ℃ |
Electrical performance | Nominal value | Unit | Test method |
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Volume resistivity | |||
25 ℃ | 1.0E+14 | ohms·cm |
Uncured Properties | Nominal value | Unit | Test method |
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Curing time | |||
80℃ | 1.0 | hr |
MECHANICAL | Nominal value | Unit | Test method |
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Shore hardness | |||
Shore A, 25 ℃ | 30 | ||
Bending modulus | |||
25℃ | 500 | MPa |
Notes |
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