KYOCERA TCG5920

About
The protection sealing of a small, electronic parts is possible. Strong Points The low temperature short time of 80 C / 60min can stiffen. An internal stress is eased, and making that the warp of the substrate is small to the package is possible. Long Pot life and excellent in work. Application Small, electronic parts, substrate connections, and protection sealing in connector part.&&

Product Description
SupplierKYOCERA
Generic热固性聚酯
Material StatusCommercial: Active
AvailabilitysAsia Pacific
Process Methodscasting

Technical Data
THERMALNominal valueUnitTest method
Glass transition temperature5.00

Electrical performanceNominal valueUnitTest method
Volume resistivity
25 ℃1.0E+14ohms·cm

Uncured PropertiesNominal valueUnitTest method
Curing time
80℃1.0hr

MECHANICALNominal valueUnitTest method
Shore hardness
Shore A, 25 ℃30
Bending modulus
25℃500MPa

Notes
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