| About |
|---|
| ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Thermal conductivity,Low to no calcium content |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| Electrical performance | Nominal value | Unit | Test method |
| Volume resistivity | 7.2E+12 | ohms·cm | |
| Dielectric strength | 39 | kV/mm | |
| Dielectric constant | |||
| 1 kHz | 5.70 | ||
| Dissipation factor | |||
| 1 kHz | 0.020 | ||
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Carrier | Glass fabirc | ||
| lap shear strength | |||
| Al to Al：25℃ | 22.8 | MPa | |
| Au to Au：25℃ | 21.4 | MPa | |
| Heating reduction | |||
| 300℃ | 0.37 | % | |
| Working period | |||
| 25℃ | 6.0 | month |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| < 102℃ | 5.0E-5 | cm/cm/℃ | |
| > 102℃ | 3.0E-4 | cm/cm/℃ | |
| Glass transition temperature | 102 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | |||
| 121℃ | 0.80 | W/m/K | |
| Storage period | |||
| -40℃ | 52 | wk | |
| Post curing time | |||
| 125℃ | 2.0 | hr | |
| 150℃ | 0.50 | hr |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
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