About |
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This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications.&& |
Product Description | |
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Generic | 环氧树脂 |
Material Status | Commercial: Active |
Features | Flame Characteristics,V-0 |
Availabilitys | Europe |
Process Methods | Injection Molding |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.91 | g/cm³ | ASTM D792 |
MECHANICAL | Nominal value | Unit | Test method |
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Bending modulus | 1.66 | MPa | ASTM D790 |
bending strength | 0.0132 | MPa | ASTM D790 |
THERMAL | Nominal value | Unit | Test method |
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Glass transition temperature | 147 | ℃ | ASTM E1356 |
Linear coefficient of thermal expansion | |||
MD | 1.4E-5 | 1/℃ | ASTM D696 |
Electrical performance | Nominal value | Unit | Test method |
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Volume resistivity | 1.0E+16 | ohms·cm | ASTM D257 |
Dielectric strength | |||
1.5 mm | 31 | kV/mm | ASTM D149 |
Dielectric constant | |||
1 kHz | 3.55 | ASTM D150 | |
Dissipation factor | |||
1 kHz | 2.0E-3 | ASTM D150 | |
Arc resistance | 180 | sec | ASTM D495 |
FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
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Flame retardant level | |||
3.20 mm | V-0 | UL 94 | |
Extreme oxygen index | 32 | % | ASTM D2863 |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
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