Plaskon AMC-2RC

About
This material is an epoxy molding compound specifically formulated for encapsulation of stress sensitive electronic devices including DIPs, SOICs, SSOPs and PLCCs. It can be used in conventional or automold applications.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesFlame Characteristics,V-0
AvailabilitysEurope
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.91g/cm³ASTM D792

MECHANICALNominal valueUnitTest method
Bending modulus1.66MPaASTM D790
bending strength0.0132MPaASTM D790

THERMALNominal valueUnitTest method
Glass transition temperature147ASTM E1356
Linear coefficient of thermal expansion
MD1.4E-51/℃ASTM D696

Electrical performanceNominal valueUnitTest method
Volume resistivity1.0E+16ohms·cmASTM D257
Dielectric strength
1.5 mm31kV/mmASTM D149
Dielectric constant
1 kHz3.55 ASTM D150
Dissipation factor
1 kHz2.0E-3 ASTM D150
Arc resistance180secASTM D495

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
3.20 mmV-0 UL 94
Extreme oxygen index32%ASTM D2863

Notes
1. Typical properties: these are not to be construed as specifications.
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