LNP™ THERMOCOMP™ DX15354 compound

About
LNP* Thermocomp* DX15354 compound is a Polycarbonate (PC) compound with improved heat resistance performance, good plating, surface aesthetics and RF performance that makes it a good candidate for internal and external parts for Laser Direct Structuring (LDS) applications.&&

Product Description
SupplierSABIC
GenericPolycarbonate
Material StatusCommercial: Active
FeaturesGood surface appearance,Electroplating
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.29g/cm³ASTM D792
Melt Volume Rate
330℃,2.16 kg63.0cm³/10minISO 1133
Water absorption rate
Equilibrium, 23 ℃, 50% RH0.13%ISO 62

MECHANICALNominal valueUnitTest method
Tensile modulus 
2920MPaASTM D638
2940MPaISO 527-1-2
tensile strength 
fracture59.0MPaASTM D638
fracture58.0MPaISO 527-2/50
Tensile strain 
fracture11%ASTM D638
fracture11%ISO 527-2/50
Bending modulus 
2890MPaASTM D790
2880MPaISO 178
bending strength 
111MPaASTM D790
112MPaISO 178

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch 
23℃61J/mASTM D256
23℃7.0kJ/m²ISO 180-1A
Notched impact strength of cantilever beam 
23℃2200J/mASTM D4812
23℃180kJ/m²ISO 180/1U

THERMALNominal valueUnitTest method
Hot deformation temperature ASTM D648
0.45 MPa, unannealed, 3.2 mm168ASTM D648
1.8 MPa, unannealed, 3.2 mm155ASTM D648
Linear coefficient of thermal expansion ASTM E831
MD:-40~40℃6.3E-51/℃ASTM E831
TD:-40~40℃6.7E-51/℃ASTM E831

Electrical performanceNominal valueUnitTest method
Dielectric constant
1.10 GHz2.95 Internal Method
Dissipation factor
1.1 GHz6.0E-3 Internal Method

Process Conditions
injectionNominal valueUnitTest method
Drying temperature135°C
Drying time4.0 to 6.0hr
Recommended maximum moisture content0.020%

Notes
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