FM® 209-1 - SOLIAO

About
FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear strength up to 121°C (250°F). FM 209-1 is designed for bonding metallic and composite substrates in monolithic and sandwich structures. It is compatible with most 121°C (250°F) and 177°C (350°F) curing epoxy-based prepreg systems for co-cure, co-bond and secondary bonding. FM 209-1 adhesive film provides minimum shop life of 30 days at 24°C (75°F). FM 209-1 adhesive has excellent resistance to both pre-bond and post- bond humidity exposures. FM 209-1 adhesive is supplied at various weights and thicknesses as an unsupported film or as a supported film with woven, knit or mat carrier. FM 209-1 film adhesive can be cured within the temperature range of 71°C to 177°C (160°F to 350°F) under vacuum-only pressure. The standard cure cycle for FM 209-1 is 121°C (250°F) for 90 minutes under full vacuum for out-of-autoclave (OOA) bonding applications or under 0.28 MPa (40 psi) pressure for autoclave cures. Suggested Applications: Out-of-autoclave bonding of metal and composite monolithic and sandwich structures Applications requiring low temperature cure Applications requiring good serviceability at low temperature&&

About

FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite structures. This new adhesive provides similar performance in vacuum-only versus autoclave cure and has a unique combination of toughness and shear strength up to 121°C (250°F). FM 209-1 is designed for bonding metallic and composite substrates in monolithic and sandwich structures. It is compatible with most 121°C (250°F) and 177°C (350°F) curing epoxy-based prepreg systems for co-cure, co-bond and secondary bonding. FM 209-1 adhesive film provides minimum shop life of 30 days at 24°C (75°F). FM 209-1 adhesive has excellent resistance to both pre-bond and post- bond humidity exposures. FM 209-1 adhesive is supplied at various weights and thicknesses as an unsupported film or as a supported film with woven, knit or mat carrier. FM 209-1 film adhesive can be cured within the temperature range of 71°C to 177°C (160°F to 350°F) under vacuum-only pressure. The standard cure cycle for FM 209-1 is 121°C (250°F) for 90 minutes under full vacuum for out-of-autoclave (OOA) bonding applications or under 0.28 MPa (40 psi) pressure for autoclave cures. Suggested Applications: Out-of-autoclave bonding of metal and composite monolithic and sandwich structures Applications requiring low temperature cure Applications requiring good serviceability at low temperature&&

Product Description
Supplier	Cytec Industries
Generic	胶黏剂
Material Status	Commercial: Active
Features	Good flexibility,Good bond,Moisture resistance
Availabilitys	North America

Technical Data
PHYSICAL	Nominal value	Unit	Test method
Density	1.25	g/cm³

THERMAL	Nominal value	Unit	Test method
Glass transition temperature	132	℃

Supplementary information	Nominal value	Unit	Test method
volatility	< 1.0	%

Notes
【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.

Notes

【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.