| About |
|---|
| HYSOL® US1151™ is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while decreasing shrinkage and cost. HYSOL® US1151™ can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature means that sensitive compounds are not damaged during low temperature excursions.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Low Viscosity,Room temperature cure |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Shrinkage rate | |||
| MD | 0.90 | % | ASTM D955 |
| Water absorption rate | |||
| 24hr | 0.20 | % | ASTM D570 |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s A | 30 | ||
| Shaw’s OO | 78 |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | -40.0 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| -70 to -50 ℃ | 9.1E-5 | cm/cm/℃ | |
| -20 to -10 ℃ | 2.5E-4 | cm/cm/℃ | |
| Thermal conductivity coefficient | 0.18 | W/m/K |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | 3.1E+14 | ohms | |
| Volume resistivity | 2.1E+13 | ohms·cm | |
| Dielectric strength | |||
| 0.508 mm | 41 | kV/mm | |
| Dielectric constant | |||
| 25 ℃，100 Hz | 4.87 | ||
| 25 ℃，1 kHz | 4.76 | ||
| 25 ℃，100 kHz | 4.39 | ||
| Dissipation factor | |||
| 25℃，100 Hz | 0.019 | ||
| 25℃，1 kHz | 0.020 | ||
| 25℃，100 kHz | 0.040 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Heating reduction | |||
| 168 hr @ 125℃ | 0.64 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | |||
| — | Black | ||
| — | Brown | ||
| Weight Mix Ratio (PBW) | |||
| Part A | 13 | ||
| Part B | 100 | ||
| Volume Mixing Ratio (PBV) | |||
| Part A | 1.0 | ||
| Part B | 10 | ||
| Density | |||
| 23℃ | 0.970 | g/cm³ | |
| 23℃ | 1.00 | g/cm³ | |
| 23℃ | 1.24 | g/cm³ | |
| viscosity | |||
| Brookfield RVF | 0.055 | Pa·s | |
| Brookfield RVF, 25 ℃ | 1.0 | Pa·s | |
| Brookfield RVF | 1.2 | Pa·s | |
| Curing time | |||
| 23℃ | 24 | hr | |
| storage stability | |||
| 23℃ | 90 | min |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Part B |
| 3. Part A |
| 4. Mixed |
| 5. 100 g mass |
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