| About |
|---|
| High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module&& |
| Product Description | |
|---|---|
| Supplier | KYOCERA |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Availabilitys | Asia Pacific |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 2.00 | g/cm³ | |
| Spiral flow length | 95.0 | cm | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Bending modulus | 22000 | MPa | |
| bending strength | 160 | MPa |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 150 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| — | 1.0E-5 | cm/cm/℃ | |
| — | 4.2E-5 | cm/cm/℃ |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Gelation time | 0.45 | min |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Alpha 1 |
| 3. Alpha 2 |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |