EPO-TEK® H35-175MPT

About
EPO-TEK® H35-175MPT is a single component, silver-filled epoxy for military hybrid die and component attach. Formerly B9119-1&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesConductive,Thixotropic,Low odor
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Particle size< 20.0µm
Ionic type 
Cl-< 200ppm
K+< 50ppm
Na+< 50ppm
NH4+32ppm

Supplementary informationNominal valueUnitTest method
Degradation Temperature354TGA
Die Shear Strength(>10 kg,23℃)23.4MPa
working temperature 
Continuous-55 to 200
Intermittent-55 to 300
Storage Modulus(23℃)2.92GPa
Thixotropic index4.60 
Heating reduction 
200℃0.030%
250℃0.050%
300℃0.13%

Uncured PropertiesNominal valueUnitTest method
colourSilver 
Density3.64g/cm³
viscosity
23℃90 to 110Pa·s
Curing time
180℃1.0hr
storage stability40000min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D83 
lap shear strength
23℃11.7MPa
Volume resistivity
23℃< 5.0E-4ohms·cm

THERMALNominal valueUnitTest method
3.5E-5cm/cm/℃
1.2E-4cm/cm/℃
Glass transition temperature> 100
Linear coefficient of thermal expansion
MD 
Thermal conductivity coefficient2.7W/m/K
Storage period
-40℃52wk

Notes
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