| About |
|---|
| ABLEBOND® 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. ABLEBOND® 84-1LMINB1 meets the requirements of MIL-STD-883, Method 5011.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Conductive,Agglomerability |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| Electrical performance | Nominal value | Unit | Test method |
| Volume resistivity | 3.0E-4 | ohms·cm | |
| PHYSICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Brookfield viscosity | |||
| CP51，25℃ | 50.0 | Pa·s |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Chloride ion | < 20 | ppm | |
| Ionic Potassium | < 10 | ppm | |
| Ionic Sodium | < 20 | ppm | |
| Shear strength – Die (IC) | |||
| 25℃ | 60801 | N | |
| 250℃ | 11768 | N | |
| Water Extract Conductivity | 9.70 | µS/cm | |
| Heating reduction | |||
| 300℃ | 0.20 | % | |
| Working period | |||
| 25℃ | 14.0 | day |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| < 90℃ | 5.0E-5 | cm/cm/℃ | |
| > 90℃ | 1.3E-4 | cm/cm/℃ | |
| Glass transition temperature | 90.0 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | 3.9 | W/m/K | |
| Storage period | |||
| -40℃ | 52 | wk | |
| -10℃ | 26 | wk | |
| 5℃ | 13 | wk | |
| Post curing time | |||
| 150℃ | 1.0 | hr |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Speed 5 rpm |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |