Zytel® HTN 51G50HSL BK083

About

Product Description
SupplierCelanese
Material StatusCommercial: Negative
FeaturesHB,Heat Stabilized
AvailabilitysNorth America,Asia Pacific,Latin America,Europe,Africa & Middle East
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Molding shrinkage
Parallel0.2%ISO 294-4
Normal0.5%ISO 294-4
Density13.7lb/galISO 1183

MECHANICALNominal valueUnitTest method
Tensile Modulus
Dry17940MPaISO 527
Wet Cond17940MPaISO 527
Tensile Stress
Broken BRK, dry dry262.2MPaISO 527
Broken BRK, wet Cond248.4MPaISO 527
Tensile Strain
Broken BRK, dry dry2.1%ISO 527
Broken BRK, wet Cond2.1%ISO 527
Flexural Modulus
Dry16422MPaISO 178
Poisson’s ratio
Dry0.33
Wet Cond0.33

IMPACTNominal valueUnitTest method
Charpy Unnotch Impact strength79.8kJ/m²ISO 179/1eU
Charpy Notched Impact Strength
23℃14.9kJ/m²ISO 179/1eA
-40℃14.9kJ/m²ISO 179/1eA

THERMALNominal valueUnitTest method
Melting temperature300ISO 11357-3
Hot deformation temperature HDT
1.8 MPa265.6ISO 75-1/-2
Coeff. of linear thermal expansion
Parallel, -40-23 ℃0.0778E-4/°FISO 11359-2
Parallel0.08E-4/°FISO 11359-2
Normal, -40-23 ℃0.25E-4/°FISO 11359-2
Normal0.267

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame Class Rating
1.6 mmHBUL 94
0.8 mmHBUL 94
Oxygen Index24%ISO 4589-2
FMVSS flame retardant ratingBISO 3795
Burning Speed1.14in/minISO 3795
Glow Wire Flammability Index (GWFI)
0.75 mm799IEC 60695-2-12
1.5 mm777IEC 60695-2-12
3.0 mm960IEC 60695-2-12

Process Conditions
Injection MoldingNominal valueUnitTest method
Drying Temperature100null
Drying Time6.0 to 8.0null
Maximum Moisture Content0.10null
Melt Temperature320 to 330null
Melt Temperature, Optimal325null
Mold Temperature140 to 180null
Mold Temperature, Optimal150null
Drying Recommendedyesnull

Notes
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