| About |
|---|
| ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.&& |
| Product Description | |
|---|---|
| Supplier | Henkel |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Moisture resistance,Insulation,Agglomerability |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| Electrical performance | Nominal value | Unit | Test method |
| Volume resistivity | 2.0E+14 | ohms·cm | |
| Dielectric strength | 31 | kV/mm | |
| PHYSICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Brookfield viscosity | |||
| CP51，25℃ | 36.5 | Pa·s |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| lap shear strength | |||
| Al to Al：25℃ | 34.5 | MPa | |
| Au to Au：25℃ | 37.9 | MPa | |
| shear strength | |||
| Die，Ceramic | 27.6 | MPa | |
| Heating reduction | |||
| 250℃ | 0.28 | % |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| < 126℃ | 6.3E-5 | cm/cm/℃ | |
| > 126℃ | 1.4E-4 | cm/cm/℃ | |
| Glass transition temperature | 126 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | |||
| 121℃ | 0.30 | W/m/K | |
| storage stability | |||
| 25 ℃ | 130000 | min | |
| Storage period | |||
| -40℃ | 52 | wk | |
| 5℃ | 26 | wk | |
| Post curing time | |||
| 93℃ | 4.0 | hr | |
| 150℃ | 0.50 | hr |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Speed 5 rpm |
| 3. 2 X 2 mm Si die |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |