About |
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Acudel® 22000 is a modified polyphenylsulfone. It is a high-heat, high-performance resin formulation exhibiting very good hydrolytic stability, excellent resistance to acids and bases and good resistance to stress cracking under a broad range of chemical environments. In addition, Acudel® 22000 resin exhibits robust toughness and improved notch resistance compared to both Udel® polysulfone and Veradel® polyethersulfone, although slightly lower than that of neat Radel® polyphenylsulfone. In general, the performance profile of Acudel® 22000 resin falls between polysulfone and polyphenylsulfone. In addition to its high mechanical and thermal performance attributes, Acudel® 22000 resin also offers very good electrical properties over a broad temperature range as well as inherent flame retardancy. Natural: Acudel® 22000 NT15 Black: Acudel® 22000 BK937&& |
Product Description | |
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Supplier | Solvay |
Generic | PPSU |
Material Status | Commercial: Active |
Features | Good flexibility,Alkali resistant,Hydrolysis stability,Flame Characteristics,Acidproof,High Heat Resistance,Solvent resistance,Heat Stabilized,High ESCR |
Availabilitys | North America,Latin America,Asia Pacific,Europe |
Process Methods | Injection Molding |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.28 | g/cm³ | ASTM D792 |
Melt Flow Rate | |||
380℃,2.16kg | 12 | g/10min | ASTM D1238 |
Shrinkage rate | |||
MD | 0.70 | % | ASTM D955 |
Water absorption rate | |||
30days | 0.90 | % | ASTM D570 |
24hr | 0.30 | % | ASTM D570 |
MECHANICAL | Nominal value | Unit | Test method |
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Tensile modulus | 2690 | MPa | ASTM D638 |
tensile strength | 77.2 | MPa | ASTM D638 |
Tensile strain | ASTM D638 | ||
yield | 6.7 | % | ASTM D638 |
fracture | 50 | % | ASTM D638 |
Bending modulus | 2760 | MPa | ASTM D790 |
bending strength | |||
yield | 108 | MPa | ASTM D790 |
IMPACT | Nominal value | Unit | Test method |
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Impact strength of cantilever beam notch | 110 | J/m | ASTM D256 |
Tensile impact strength | 368 | kJ/m² | ASTM D1822 |
THERMAL | Nominal value | Unit | Test method |
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Hot deformation temperature | |||
1.8 MPa, annealed, 3.18 mm | 197 | ℃ | ASTM D648 |
Electrical performance | Nominal value | Unit | Test method |
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Volume resistivity | > 9.0E+15 | ohms·cm | ASTM D257 |
Dielectric strength | |||
3.18 mm | 19 | kV/mm | ASTM D149 |
Dielectric constant | |||
1 MHz | 3.40 | ASTM D150 | |
Dissipation factor | |||
1 MHz | 8.0E-3 | ASTM D150 |
Process Conditions | |||
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injection | Nominal value | Unit | Test method |
Drying temperature | 177 | °C | |
Drying time | 2.5 | hr | |
Processing (melt) temperature | 360 to 391 | °C | |
Mold temperature | 138 to 163 | °C |
Notes |
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1. Tested at 82 °C (180 °F) (Commercial Hot) |
2. Typical properties: these are not to be construed as specifications. |
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