Acudel® 22000

About
Acudel® 22000 is a modified polyphenylsulfone. It is a high-heat, high-performance resin formulation exhibiting very good hydrolytic stability, excellent resistance to acids and bases and good resistance to stress cracking under a broad range of chemical environments. In addition, Acudel® 22000 resin exhibits robust toughness and improved notch resistance compared to both Udel® polysulfone and Veradel® polyethersulfone, although slightly lower than that of neat Radel® polyphenylsulfone. In general, the performance profile of Acudel® 22000 resin falls between polysulfone and polyphenylsulfone. In addition to its high mechanical and thermal performance attributes, Acudel® 22000 resin also offers very good electrical properties over a broad temperature range as well as inherent flame retardancy. Natural: Acudel® 22000 NT15 Black: Acudel® 22000 BK937&&

Product Description
SupplierSolvay
GenericPPSU
Material StatusCommercial: Active
FeaturesGood flexibility,Alkali resistant,Hydrolysis stability,Flame Characteristics,Acidproof,High Heat Resistance,Solvent resistance,Heat Stabilized,High ESCR
AvailabilitysNorth America,Latin America,Asia Pacific,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.28g/cm³ASTM D792
Melt Flow Rate
380℃,2.16kg12g/10minASTM D1238
Shrinkage rate
MD0.70%ASTM D955
Water absorption rate
30days0.90%ASTM D570
24hr0.30%ASTM D570

MECHANICALNominal valueUnitTest method
Tensile modulus2690MPaASTM D638
tensile strength77.2MPaASTM D638
Tensile strain ASTM D638
yield6.7%ASTM D638
fracture50%ASTM D638
Bending modulus2760MPaASTM D790
bending strength
yield108MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch110J/mASTM D256
Tensile impact strength368kJ/m²ASTM D1822

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, annealed, 3.18 mm197ASTM D648

Electrical performanceNominal valueUnitTest method
Volume resistivity> 9.0E+15ohms·cmASTM D257
Dielectric strength
3.18 mm19kV/mmASTM D149
Dielectric constant
1 MHz3.40 ASTM D150
Dissipation factor
1 MHz8.0E-3 ASTM D150

Process Conditions
injectionNominal valueUnitTest method
Drying temperature177°C
Drying time2.5hr
Processing (melt) temperature360 to 391°C
Mold temperature138 to 163°C

Notes
1. Tested at 82 °C (180 °F) (Commercial Hot)
2. Typical properties: these are not to be construed as specifications.
【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.