AMPLIFY™ EA 101

About
AMPLIFY™ EA 101 Functional Polymer is produced via a high-pressure reactor. This ethylene-ethyl acrylate (EEA) copolymer exhibits high flexibility and imparts low temperature toughness to a wide range of engineering resins. This polymer demonstrates excellent blend compatibility with other polyolefins. It can be utilized as a tie layer between polyolefins and a variety of polar substrates, such as metal, polyvinylidiene chloride (PVDC), polyolefins, cellulose, polyester, polycarbonate, glass, foil, PVC, PET, and Polystyrene. High performance packaging applications Polymer modification Tie layer to PVDC and Polyolefins Superior additive concentrate carrier Low gels with excellent thermal stability Complies with: U.S. FDA 21 CFR 175.105 U.S. FDA 21 CFR 177.1320 (with Restrictions) EU, No 10/2011 Consult the regulations for complete details.&&

Product Description
SupplierDOW
GenericEEA
Material StatusCommercial: Active
AvailabilitysNorth America,Latin America

Technical Data
PHYSICALNominal valueUnitTest method
Density0.931g/cm³ASTM D792 , ISO 1183
Melt Flow Rate
190℃,2.16kg6.0g/10minASTM D1238,ISO 1133
Co monomer content18.5%ASTM D3594

IMPACTNominal valueUnitTest method
Tensile impact strength672kJ/m²ASTM D1822

THERMALNominal valueUnitTest method
Hot deformation temperature
0.45 MPa, unannealed31.1ASTM D648
Embrittlement temperature< -76.1ASTM D746
Vicat Softening Temp57.2ASTM D1525 , ISO 306
Melting temperature
DSC97.8Internal Method
Crystallization peak temperature
DSC82.8Internal Method

MECHANICALNominal valueUnitTest method
Shore hardness ASTM D2240 , ISO 868
Shaw’s A86 ASTM D2240 , ISO 868
Shaw’s D31 ASTM D2240 , ISO 868
tensile strength ASTM D638 , ISO 527-2
yield2.96MPaASTM D638 , ISO 527-2
fracture13.4MPaASTM D638 , ISO 527-2
Tensile strain ASTM D638 , ISO 527-2
yield10%ASTM D638 , ISO 527-2
fracture750%ASTM D638 , ISO 527-2
Bending modulus
2% secant55.2MPaASTM D790B , ISO 178

Notes
1. Typical properties: these are not to be construed as specifications.
2. Calibration Range is 15 – 20% EA; Pathlength is normalized; Plaque/Film Thickness is 15 mil; Press Temperature is 160°C
3. Type S
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