APTIV® 1102

About
APTIV® 1100 series films are the mineral filled semi-crystalline films made from VICTREX® PEEK™ polymer. The film provides a material solution for engineers in ultra-high performance applications. APTIV films are a comprehensive range of versatile, high-performance films, the use of which can facilitate reduced systems costs, improved performance and enhanced design freedom. APTIV 1100 has a unique combination of properties providing high temperature performance, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler for our customers and end users. APTIV 1100 series provides a higher modulus and lower coefficient of linear thermal expansion over the APTIV 1000 series.&&

Product Description
SupplierVictrex
Material StatusCommercial: Active
FeaturesLow smoke,Insulation,Good heat sealing,Block resin,Excellent Processability,Laser engraving,High purity,Good flexibility,Machinable,Welding,Hydrolysis stability,Good bond,High Heat Resistance,Low toxicity,Renewable resources,Good Printability,Flame Characteristics,Solvent resistance,Gamma radiation,Electroplating,Hypocrystalline,Good Rigidity,Halogen free,Durability,Low moisture absorption
AvailabilitysAfrica & Middle East ,Europe,Asia Pacific,Latin America,North America
Process MethodsThermo forming

Technical Data
PHYSICALNominal valueUnitTest method
Density1.45g/cm³ISO 1183
Water Absorption
Equilibrium balanced, 23 ℃, 50% RH, 0.05 mm0.080%ISO 62
Molding shrinkage 
MD:200℃,50.0 µm< 0.50%
TD:200℃,50.0 µm< 0.50%

MECHANICALNominal valueUnitTest method
Film thickness25 to 125 µm 
Tensile Modulus ISO 527-3
MD,23℃,25 µm5000MPaISO 527-3
TD,23℃,25 µm4500MPaISO 527-3
MD,23℃,50 µm4800MPaISO 527-3
TD,23℃,50 µm4300MPaISO 527-3
MD,23℃,100 µm4500MPaISO 527-3
TD,23℃,100 µm4200MPaISO 527-3
Tensile Strength ISO 527-3
MD, fracture BRK, 23 ℃, 25 µ m100MPaISO 527-3
TD, fracture BRK, 23 ℃, 25 µ m80.0MPaISO 527-3
MD, fracture BRK, 23 ℃, 50 µ m100MPaISO 527-3
TD, fracture BRK, 23 ℃, 50 µ m80.0MPaISO 527-3
MD, fracture BRK, 23 ℃, 100 µ m100MPaISO 527-3
TD, fracture BRK, 23 ℃, 100 µ m80.0MPaISO 527-3
Tensile Strain ISO 527-3
MD, fracture BRK, 23 ℃, 25 µ m> 100%ISO 527-3
TD, fracture BRK, 23 ℃, 25 µ m> 10%ISO 527-3
MD, fracture BRK, 23 ℃, 50 µ m> 100%ISO 527-3
TD, fracture BRK, 23 ℃, 50 µ m> 10%ISO 527-3
MD, fracture BRK, 23 ℃, 100 µ m> 100%ISO 527-3
TD, fracture BRK, 23 ℃, 100 µ m> 10%ISO 527-3
Pant shape tear resistance ISO 6383-1
MD:50 µm6.00N/mmISO 6383-1
TD:50 µm7.00N/mmISO 6383-1

THERMALNominal valueUnitTest method
Coeff. of linear thermal expansion
MD:0.05 mm3.5E-51/℃ASTM D696
Thermal conductivity ASTM E1461
0.43W/m/KASTM E1461
0.91W/m/KASTM E1461

ELECTRICALNominal valueUnitTest method
Volume Resistance
23 ℃,0.05 mm1.0E+16ohms·cmASTM D257
Dielectric Strength
23 ℃,0.05 mm200kV/mmASTM D149
Dielectric Constant
23 ℃,0.05 mm,10 MHz3.60 ASTM D150
Dissipation Factor
23℃,0.05 mm,10 MHz1.0E-3 ASTM D150

Supplementary InformationNominal valueUnitTest method
Puncture Resistance
23℃,50.0 µm5.00kJ/m²Internal Method

Notes
1. Typical properties: these are not to be construed as specifications.
2. 24 hrs, 23°C
3. TM-VX-84
4. 23°C
5. below Tg
6. Through Plane
7. In-Plane
8. 100 V
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