| About |
|---|
| APTIV® 1100 series films are the mineral filled semi-crystalline films made from VICTREX® PEEK™ polymer. The film provides a material solution for engineers in ultra-high performance applications. APTIV films are a comprehensive range of versatile, high-performance films, the use of which can facilitate reduced systems costs, improved performance and enhanced design freedom. APTIV 1100 has a unique combination of properties providing high temperature performance, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler for our customers and end users. APTIV 1100 series provides a higher modulus and lower coefficient of linear thermal expansion over the APTIV 1000 series.&& |
| Product Description | |
|---|---|
| Supplier | Victrex |
| Material Status | Commercial: Active |
| Features | Good Rigidity,Machinable,High purity,Welding,Excellent Processability,Good Printability,Renewable resources,Flame Characteristics,Solvent resistance,High Heat Resistance,Gamma radiation,Good bond,Good heat sealing,Low moisture absorption,Low toxicity,Electroplating,Block resin,Halogen free,Hydrolysis stability,Durability,Hypocrystalline,Insulation,Laser engraving,Good flexibility,Low smoke |
| Availabilitys | North America,Asia Pacific,Africa & Middle East ,Europe,Latin America |
| Process Methods | Thermo forming |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.54 | g/cm³ | ISO 1183 |
| Water Absorption | |||
| Equilibrium balanced, 23 ℃, 50% RH, 0.05 mm | 0.090 | % | ISO 62 |
| Molding shrinkage | |||
| MD：200℃，50.0 µm | % | ||
| TD：200℃，50.0 µm | % | ||
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Film thickness | 25 to 125 µm | ||
| Tensile Modulus | ISO 527-3 | ||
| MD，23℃，25 µm | 5500 | MPa | |
| TD，23℃，25 µm | 4500 | MPa | |
| MD，23℃，50 µm | 5500 | MPa | |
| TD，23℃，50 µm | 4500 | MPa | |
| MD，23℃，100 µm | 5000 | MPa | |
| TD，23℃，100 µm | 4500 | MPa | |
| Tensile Strength | ISO 527-3 | ||
| MD, fracture BRK, 23 ℃, 25 µ m | 70.0 | MPa | |
| TD, fracture BRK, 23 ℃, 25 µ m | 70.0 | MPa | |
| MD, fracture BRK, 23 ℃, 50 µ m | 90.0 | MPa | |
| TD, fracture BRK, 23 ℃, 50 µ m | 90.0 | MPa | |
| MD, fracture BRK, 23 ℃, 100 µ m | 90.0 | MPa | |
| TD, fracture BRK, 23 ℃, 100 µ m | 90.0 | MPa | |
| Tensile Strain | ISO 527-3 | ||
| MD, fracture BRK, 23 ℃, 25 µ m | > 10 | % | |
| TD, fracture BRK, 23 ℃, 25 µ m | < 10 | % | |
| MD, fracture BRK, 23 ℃, 50 µ m | > 10 | % | |
| TD, fracture BRK, 23 ℃, 50 µ m | < 10 | % | |
| MD, fracture BRK, 23 ℃, 100 µ m | > 5.0 | % | |
| TD, fracture BRK, 23 ℃, 100 µ m | < 10 | % | |
| Pant shape tear resistance | ISO 6383-1 | ||
| MD：50 µm | 5.00 | N/mm | |
| TD：50 µm | 6.00 | N/mm |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Coeff. of linear thermal expansion | |||
| MD：0.05 mm | 1.8E-5 | 1/℃ | ASTM D696 |
| Thermal conductivity | ASTM E1461 | ||
| — | 0.61 | W/m/K | |
| — | 1.3 | W/m/K |
| ELECTRICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Volume Resistance | |||
| 23 ℃，0.05 mm | 1.0E+16 | ohms·cm | ASTM D257 |
| Dielectric Strength | |||
| 23 ℃，0.05 mm | 200 | kV/mm | ASTM D149 |
| Dielectric Constant | |||
| 23 ℃，0.05 mm，10 MHz | 3.50 | ASTM D150 | |
| Dissipation Factor | |||
| 23℃，0.05 mm，10 MHz | 1.0E-3 | ASTM D150 |
| Supplementary Information | Nominal value | Unit | Test method |
|---|---|---|---|
| Puncture Resistance | |||
| 23℃，50.0 µm | 4.00 | kJ/m² | Internal Method |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. 24 hrs, 23°C |
| 3. TM-VX-84 |
| 4. 23°C |
| 5. below Tg |
| 6. Through Plane |
| 7. In-Plane |
| 8. 100 V |
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