| About |
|---|
| APTIV® 2000 series films are the unfilled amorphous films made from VICTREX® PEEK™ polymer. The film provides a material solution for engineers in ultra-high performance applications. APTIV films are a comprehensive range of versatile, high-performance films, the use of which can facilitate reduced systems costs, improved performance and enhanced design freedom. APTIV 2000 has a unique combination of properties providing high temperature performance, light weight, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, wear and abrasion resistance, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler for our customers and end users. Please note – APTIV 2000 will crystallize if taken above the Tg (143°C, 289°F) in either secondary processes or end use application. The crystallization is not reversible back to the amorphous phase without re-melting the material. Consideration of the temperature range during processing and end use application needs to be included if selecting APTIV 2000.&& |
| Product Description | |
|---|---|
| Supplier | Victrex |
| Material Status | Commercial: Active |
| Features | Durability,Welding,Good heat sealing,Excellent Processability,Solvent resistance,High Heat Resistance,Low smoke,Low moisture absorption,Good Rigidity,Renewable resources,Halogen free,Low toxicity,High purity,Electroplating,Good flexibility,Amorphous,Hydrolysis stability,Block resin,Gamma radiation,Good Printability,Insulation,Flame Characteristics,Good wear resistance |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Process Methods | Thermo forming |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.26 | g/cm³ | ISO 1183 |
| Water Absorption | |||
| Equilibrium balanced, 23 ℃, 50% RH, 0.05 mm | 0.21 | % | ISO 62 |
| Molding shrinkage | |||
| MD：200℃，50.0 µm | < 10 | % | |
| TD：200℃，50.0 µm | < 5.0 | % | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Film thickness | 6 to 300 µm | ||
| Tensile Modulus | ISO 527-3 | ||
| MD，23℃，25 µm | 1800 | MPa | ISO 527-3 |
| TD，23℃，25 µm | 1800 | MPa | ISO 527-3 |
| MD，23℃，50 µm | 1800 | MPa | ISO 527-3 |
| TD，23℃，50 µm | 1800 | MPa | ISO 527-3 |
| MD，23℃，100 µm | 1600 | MPa | ISO 527-3 |
| TD，23℃，100 µm | 1600 | MPa | ISO 527-3 |
| Tensile Strength | ISO 527-3 | ||
| MD, fracture BRK, 23 ℃, 25 µ m | 130 | MPa | ISO 527-3 |
| TD, fracture BRK, 23 ℃, 25 µ m | 130 | MPa | ISO 527-3 |
| MD, fracture BRK, 23 ℃, 50 µ m | 120 | MPa | ISO 527-3 |
| TD, fracture BRK, 23 ℃, 50 µ m | 120 | MPa | ISO 527-3 |
| MD, fracture BRK, 23 ℃, 100 µ m | 120 | MPa | ISO 527-3 |
| TD, fracture BRK, 23 ℃, 100 µ m | 120 | MPa | ISO 527-3 |
| Tensile Strain | ISO 527-3 | ||
| MD, fracture BRK, 23 ℃, 25 µ m | > 200 | % | ISO 527-3 |
| TD, fracture BRK, 23 ℃, 25 µ m | > 200 | % | ISO 527-3 |
| MD, fracture BRK, 23 ℃, 50 µ m | > 200 | % | ISO 527-3 |
| TD, fracture BRK, 23 ℃, 50 µ m | > 200 | % | ISO 527-3 |
| MD, fracture BRK, 23 ℃, 100 µ m | > 200 | % | ISO 527-3 |
| TD, fracture BRK, 23 ℃, 100 µ m | > 200 | % | ISO 527-3 |
| Pant shape tear resistance | ISO 6383-1 | ||
| MD：50 µm | 6.00 | N/mm | ISO 6383-1 |
| TD：50 µm | 6.00 | N/mm | ISO 6383-1 |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Crystallization peak temperature | |||
| DSC | 143 | ℃ | |
| Coeff. of linear thermal expansion | |||
| MD：0.05 mm | 6.0E-5 | 1/℃ | ASTM D696 |
| ELECTRICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Volume Resistance | |||
| 23 ℃，0.05 mm | 2.0E+16 | ohms·cm | ASTM D257 |
| Dielectric Strength | ASTM D149 | ||
| 23 ℃，0.025 mm | 270 | kV/mm | ASTM D149 |
| 23 ℃，0.05 mm | 190 | kV/mm | ASTM D149 |
| 23 ℃，0.1 mm | 120 | kV/mm | ASTM D149 |
| Dielectric Constant | |||
| 23 ℃，0.05 mm，10 MHz | 3.30 | ASTM D150 | |
| Dissipation Factor | |||
| 23℃，0.05 mm，10 MHz | 3.0E-3 | ASTM D150 | |
| Breakdown voltage | ASTM D149 | ||
| 23℃，25.0 µm | 6750 | V | ASTM D149 |
| 23℃，50.0 µm | 9500 | V | ASTM D149 |
| 23℃，125.0 µm | 15000 | V | ASTM D149 |
| Supplementary Information | Nominal value | Unit | Test method |
|---|---|---|---|
| Puncture Resistance | |||
| 23℃，50.0 µm | 40.0 | kJ/m² | Internal Method |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. 24 hrs |
| 3. TM-VX-84 |
| 4. 23°C |
| 5. below Tg |
| 6. 100 V |
| 7. 6.35 mm electrode |
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