| About |
|---|
| 38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.&& |
| Product Description | |
|---|---|
| Generic | TPI |
| Material Status | Commercial: Active |
| Features | Low liquidity,Good Electrical Properties,Lead content is low to none,Heat Stabilized,Fast Cure,Agglomerability,V-0 |
| Availabilitys | North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Water absorption rate | |||
| 24hr | < 1.0 | % | Internal Method |
| decomposition temperature | Internal Method | ||
| 5% | 330 | ℃ | Internal Method |
| Intial | 311 | ℃ | Internal Method |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| tensile strength | 221 | MPa | Internal Method |
| bending strength | 414 | MPa | Internal Method |
| Poisson’s ratio | 0.17 | ASTM D3039 |
| film | Nominal value | Unit | Test method |
|---|---|---|---|
| peel strength | Internal Method | ||
| — | 1.5 | kN/m | Internal Method |
| to Kapton | 1.0 | kN/m | Internal Method |
| to Kapton | 0.9 | kN/m | Internal Method |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 200 | ℃ | Internal Method |
| Linear coefficient of thermal expansion | |||
| MD | |||
| — | 1.7E-5 | cm/cm/℃ | Internal Method |
| < 200℃ | 5.4E-5 | cm/cm/℃ | Internal Method |
| > 200℃ | 1.6E-4 | cm/cm/℃ | Internal Method |
| Thermal conductivity coefficient | |||
| 100℃ | 0.30 | W/m/K | ASTM E1461 |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | Internal Method | ||
| — | 4.4E+12 | ohms | Internal Method |
| — | 1.2E+15 | ohms | Internal Method |
| Volume resistivity | Internal Method | ||
| — | 8.2E+13 | ohms·cm | Internal Method |
| — | 4.7E+15 | ohms·cm | Internal Method |
| Dielectric strength | 63 | kV/mm | Internal Method |
| Dielectric constant | |||
| 1 MHz | 4.25 | Internal Method | |
| Dissipation factor | |||
| 1 MHz | 0.010 | Internal Method | |
| Arc resistance | 125 | sec | Internal Method |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| Flame retardant level | V-0 | UL 94 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Expansion rate | |||
| 50 to 260 ℃ | 1.5 | % | Internal Method |
| T260 | 50.0 | min | Internal Method |
| T288 | 5.0 | min | Internal Method |
| T300 | 3.0 | min | Internal Method |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. x and y direction |
| 3. After Thermal Stress |
| 4. As Recieved |
| 5. After Solder |
| 6. X-axis |
| 7. Z-axis |
| 8. E24/125 |
| 9. C96/35/90 |
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