| About |
|---|
| Arlon’s AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications. The AD Series is currently available in a limited combination of dielectric thickness (0.015″ – 0.062″) and dielectric constant (2.5 – 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates. Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.&& |
| Product Description | |
|---|---|
| Generic | PTFE |
| Material Status | Commercial: Active |
| Features | Good Dimensional Stability,Quick molding cycle,V-0 |
| Availabilitys | North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 2.40 | g/cm³ | ASTM D792-A |
| Water absorption rate | |||
| 23℃，24hr | 0.070 | % | ASTM D570 |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Tensile modulus | ASTM D638 | ||
| 23℃ | 4870 | MPa | ASTM D638 |
| 23℃ | 3560 | MPa | ASTM D638 |
| Bending modulus | |||
| 23℃ | 3720 | MPa | ASTM D790 |
| Compression modulus | 2520 | MPa | ASTM D695 |
| film | Nominal value | Unit | Test method |
|---|---|---|---|
| tensile strength | ASTM D882 | ||
| MD, yield | 144 | MPa | ASTM D882 |
| TD, yield | 119 | MPa | ASTM D882 |
| peel strength | -2.5 | kN/m | Internal Method |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Thermal conductivity coefficient | |||
| 100℃ | 0.24 | W/m/K | ASTM C177 |
| Linear coefficient of thermal expansion | |||
| X Axis：0~100℃ | 1.2E-5 | 1/℃ | Internal Method |
| Y Axis：0~100℃ | 1.5E-5 | 1/℃ | Internal Method |
| Z Axis：0~100℃ | 9.5E-5 | 1/℃ |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | 4.5E+7 | ohms | Internal Method |
| Volume resistivity | 1.2E+15 | ohms·cm | Internal Method |
| Dielectric constant | |||
| 23℃ | 3.50 | Internal Method | |
| Dissipation factor | |||
| 10 GHz | 3.0E-3 | Internal Method | |
| Arc resistance | > 180 | sec | ASTM D495 |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| Flame retardant level | V-0 | UL 94 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| breakdown voltage | > 45000 | V | ASTM D149 |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. TD |
| 3. MD |
| 4. After Thermal Stress |
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