AURUM® PI-PA

About
AURUM ® PIPA exhibits a glass transition temperature of 258°C and has higher heat resistance than that of the standard AURUM ® resins (glass transition temperature: 250°C). AURUM ® PI-PA shows better extrudability than that of the standard AURUM ® resins and is suitable for the manufacture of stock shapes. Because of its low rate of crystallization, AURUM ® PI-PA is practically non-crystalline.&&

Product Description
SupplierMitsui
GenericTPI
Material StatusCommercial: Negative
FeaturesHeat Resistance, Good
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Melt Flow Rate
400℃,1.05kg8.0g/10min

MECHANICALNominal valueUnitTest method
tensile strength95.0MPa
Tensile strain
fracture82%
Bending modulus3030MPa

THERMALNominal valueUnitTest method
Glass transition temperature258
Melting temperature380
Crystallization peak temperature
DSC320

Supplementary informationNominal valueUnitTest method
Crystallization rate
t1/2min100 

Process Conditions
injectionNominal valueUnitTest method
Processing (melt) temperature380 to 420°C
Mold temperature180 to 200°C

Notes
1. Typical properties: these are not to be construed as specifications.
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