BCC BC 5105 Resins

About
BC 5105 is a clear, unfilled, low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without post-curing. For use above 150°F a post-cure may be required. BC 5105 can afford consistent use to 300°F if required. Does not contain VCHD or MDA. Useful for: Constructing vacuum form tools Injection and compression molds RTM and RIM molds Matched dies&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesLow Viscosity,High Heat Resistance
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density 
1.15g/cm³ASTM D792
1.13g/cm³ASTM D1505

Thermosetting mixed viscosityNominal valueUnitTest method
24℃2000cPASTM D2393
stripping time
24℃1400min

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D90 ASTM D2240
tensile strength
limit200MPaASTM D638
bending strength
fracture234MPaASTM D790
compressive strength404MPaASTM D695

THERMALNominal valueUnitTest method
Hot deformation temperature
1.8 MPa, unannealed145ASTM D648
Linear coefficient of thermal expansion
MD1.6E-51/℃ASTM D696
Thermosetting components 
resin按重量计算的混合比: 100, 按容量计算的混合比: 100 
Hardening method按重量计算的混合比: 17, 按容量计算的混合比: 20 
storage stability
24 ℃55min

Notes
1. Typical properties: these are not to be construed as specifications.
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