About |
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BC 5105 is a clear, unfilled, low viscosity laminating system. This heat resistant resin exhibits excellent wet out, reasonable working time and may be used at room temperature without post-curing. For use above 150°F a post-cure may be required. BC 5105 can afford consistent use to 300°F if required. Does not contain VCHD or MDA. Useful for: Constructing vacuum form tools Injection and compression molds RTM and RIM molds Matched dies&& |
Product Description | |
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Generic | 环氧树脂 |
Material Status | Commercial: Active |
Features | Low Viscosity,High Heat Resistance |
Availabilitys | North America |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | |||
— | 1.15 | g/cm³ | ASTM D792 |
— | 1.13 | g/cm³ | ASTM D1505 |
Thermosetting mixed viscosity | Nominal value | Unit | Test method |
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24℃ | 2000 | cP | ASTM D2393 |
stripping time | |||
24℃ | 1400 | min |
MECHANICAL | Nominal value | Unit | Test method |
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Shore hardness | |||
Shaw’s D | 90 | ASTM D2240 | |
tensile strength | |||
limit | 200 | MPa | ASTM D638 |
bending strength | |||
fracture | 234 | MPa | ASTM D790 |
compressive strength | 404 | MPa | ASTM D695 |
THERMAL | Nominal value | Unit | Test method |
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Hot deformation temperature | |||
1.8 MPa, unannealed | 145 | ℃ | ASTM D648 |
Linear coefficient of thermal expansion | |||
MD | 1.6E-5 | 1/℃ | ASTM D696 |
Thermosetting components | |||
resin | 按重量计算的混合比: 100, 按容量计算的混合比: 100 | ||
Hardening method | 按重量计算的混合比: 17, 按容量计算的混合比: 20 | ||
storage stability | |||
24 ℃ | 55 | min |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
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