BONDZ GG 174

About
Selenis Bondz GG 174 is a copolyester specifically designed for sealing layers in GAG coextruded films. Selenis has developed this bonding solution to consistently deliver excellent melt strength and exceptional heat-sealing performance. This product is formulated to provide and sustain the adhesion level crucial to the packaging integrity through the different processes of manufacturing, from coextrusion to thermoforming, securing full protection of the final product. Selenis Bondz GG 174 greatly improves your film, providing enhanced printability, effortless trimming and easier thermoformability; hence boosting your energy efficiency. Selenis Bondz GG174 may be used as a primary or secondary packaging material for thermoformed trays, blister applications, and form-fill-seal applications up to 75°C. Selenis Bondz GG174 guarantees no crystalline haze; thereby assuring your film will be crystal-clear. This solution ensures exceptional adhesion level, while maintaining high clarity and gloss, certifying optimal visual appeal at point of sale.&&

Product Description
GenericPETG
Material StatusCommercial: Active
FeaturesGood Clarity,Good surface appearance,Good heat sealing,Renewable resources,Good Printability,Food contact compliance,Good bond,Good melt strength
AvailabilitysNorth America,Latin America,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Density1.27g/cm³ASTM D792
Apparent density0.73g/cm³
Intrinsic viscosity0.72 to 0.76dl/gISO 1628-5
Color b< 3.00 ASTM D6290
Color L> 64.0 ASTM D6290
Particle ShapeCylindrical 
Particle size270 to 370mg/20 chips
humidity< 0.30%

THERMALNominal valueUnitTest method
Glass transition temperature85.0ASTM D3410

Process Conditions
ExtrusionNominal valueUnitTest method
Drying temperature65°C
Drying time5.0 to 6.0hr
Recommended maximum moisture content4.0E-3%
Melt temperature180 to 250°C

Notes
1. Typical properties: these are not to be construed as specifications.
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