About Thermoset Plastics 264 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for coating. Typical application of Thermoset Plastics 264: Coating Applications&& Product Description Supplier Lord Generic 环氧树脂 Material Status Commercial: Active Features Thixotropic Availabilitys North…
About ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Thermal conductivity,Low to no calcium content Availabilitys North America Technical Data Electrical performance Nominal value Unit Test…
About E-16521A is an encapsulation grade epoxy molding compound suitable for electrical applications such as coils.&& Product Description Supplier SBHPP Generic 环氧树脂 Material Status Commercial: Active Availabilitys North America Technical Data PHYSICAL Nominal value Unit Test method Density 1.60 g/cm³…
About EPX 81 is our most accurate high strength engineering material. It has a heat deflection temperature of 140 °C.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Good Rigidity Availabilitys North America Process Methods 180320 Technical Data PHYSICAL…
About HYSOL® ES1900™ is a transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good wetting, cures at room temperature and develops…
About EpoxAmite® White Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite® White Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical…
About A steel-filled, liquid epoxy designed for maintaining and/or repairing tooling, mold-making, and leveling equipment. Intended Use: Holding fixtures for intricate parts; filling and leveling equipment; repairing hard-to-reach areas where a flowable epoxy is needed; duplicating or tracing masters; short…
About Thermoset Plastics 311 is an Epoxy; Epoxide (Epoxy) material filled with filler. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics 311 are: Heat Resistant Insulating Rigid Typical application of Thermoset Plastics 311:…
About Epic R1055/H5083 is a vacuum grade modified epoxy system designed to achieve penetration of tightly wound electrical coils. The system cures at ambient temperatures thereby affording the user the opportunity to reduce substantial energy costs normally associated with heat…
About Metlbond 1515-4 is a 350°F (177°C) curing modified epoxy supported film adhesives. Metlbond 1515-4 can also be cured at 250°F (121°C). Its maximum continuous service temperature range is 275°F to 320°F (135°C to 160°C). Metlbond 1515-4 is commonly used…
About CORFIL 658 is a one-part epoxy material designed for use in insert or edge filling of honeycomb structure. The low viscosity of CORFIL 658 makes it especially suitable for automated or hand filling of small cell sized honeycomb. The…
About E-Pos 530 is a new low viscosity bisphenol A epoxy resin diluted with an epoxidised alkyl phenol of natural source. Product characteristics E-Pos 530 exhibits low volatility and excellent crystallisation resistance. The low viscosity of the resin allows high…
About EPO-TEK® H35-175MP is a single component, silver-filled epoxy for military hybrid die and component attach.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Conductive,Thixotropic,Low odor Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical Data PHYSICAL Nominal value…
About A UV fast curing, optically clear adhesive offering compliance and high strength. Formerly 75-145&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Good Rigidity,UV Cure,Fast Cure Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical Data optical performance…
About Lytex 4129 is a high performance, glass fiber reinforced epoxy sheet molding compound designed for military and aerospace structural applications requiring excellent mechanical properties, retention of properties at elevated temperatures, good chemical resistance and excellent electrical properties. It is…
About Magnobond 108 is an Epoxy; Epoxide (Epoxy) product. It is available in North America. Typical application: Adhesives/Tapes.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys North America Technical Data PHYSICAL Nominal value Unit Test method Density 0.668 g/cm³…
About Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. Used in Auto Molding System by Rapid Cure Grades. KE-870 and KE-880…
About A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber optic…
About Ad-Tech Epoxy EL-315-IHL is an Epoxy; Epoxide (Epoxy) product. It can be processed by laminating and is available in North America. Applications of Ad-Tech Epoxy EL-315-IHL include aerospace and coating applications. Primary characteristic: heat resistant.&& Product Description Generic 环氧树脂…
About EPO-TEK® OD2002 is a two component, thermally and electrically insulating, optical epoxy. Designed as a high Tg yet still complilant alternative to EPO-TEK® 353ND.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thermal insulation,Biocompatible,Insulation Availabilitys Africa & Middle…