About FM® 680-1 polyimide adhesive is a non-metallic version of FM 680 film adhesive designed for continuous service at temperature up to 700°F (371°C). FM 680-1 adhesive was specifically developed for radar transparent applications requiring extreme environmental durability. FM 680-1…
About The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with…
About APICAL 500AV APICAL 500AV is a Thermoset Polyimide material. It is available in North America. Important attributes of APICAL 500AV are: Flame Rated Chemical Resistant Good Dimensional Stability Good Flexibility Typical applications include: Adhesives/Tapes Electrical/Electronic Applications Film Wire…
About APICAL 200AF011 is a Thermoset Polyimide material. It is available in North America. Important attributes of APICAL 200AF011 are: Flame Rated Chemical Resistant Flame Retardant Good Sealability Moisture Resistant Typical application of APICAL 200AF011: Film&& Product Description Supplier Kaneka…
About FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb…
About Product Description Supplier Quadrant Material Status Commercial: Active Features Low coefficient of friction,Lubricating Technical Data PHYSICAL Nominal value Unit Test method THERMAL Nominal value Unit Test method FLAME CHARACTERISTICS Nominal value Unit Test method MECHANICAL Nominal value Unit Test…
About The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with…
About APICAL 120AF616 APICAL 120AF616 is a Thermoset Polyimide material. It is available in North America. Important attributes of APICAL 120AF616 are: Flame Rated Chemical Resistant Flame Retardant Good Sealability Moisture Resistant Typical application of APICAL 120AF616: Film&&APICAL …
About A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine…
About APICAL 150AF019 APICAL 150AF019 is a Thermoset Polyimide material. It is available in North America. Important attributes of APICAL 150AF019 are: Flame Rated Chemical Resistant Flame Retardant Good Sealability Moisture Resistant Typical application of APICAL 150AF019: Film&&APICAL …
About The Pyre ML® product line encompasses a family of enamels employed in insulation of magnet wire. The insulated wire based on Pyre ML® enamel has the highest thermal rating of 240° C continuous use temperature from NEMA. In addition…
About The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with…
About The Pyre ML® product line encompasses a family of enamels employed in insulation of magnet wire. The insulated wire based on Pyre ML® enamel has the highest thermal rating of 240° C continuous use temperature from NEMA. In addition…
About EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging.&& Product Description Generic PI Material Status Commercial: Active Features Conductive,Thixotropic,High Heat Resistance,Thermal conductivity Availabilitys…
About CT4000 Series has the Highest Heat Resistivity Among Organic Material. CT4200H Standard Type (Overcoat of the Semiconductor Device) This is Standard Type in our Polyimide Products with High Heat Resistivity. The Impurities are Extremely Little, and It is the…
About APICAL 200AF919 APICAL 200AF919 is a Thermoset Polyimide material. It is available in North America. Important attributes of APICAL 200AF919 are: Flame Rated Chemical Resistant Flame Retardant Good Sealability Moisture Resistant Typical application of APICAL 200AF919: Film&&APICAL …
About The Pyre ML® product line encompasses a family of enamels employed in insulation of magnet wire. The insulated wire based on Pyre ML® enamel has the highest thermal rating of 240° C continuous use temperature from NEMA. In addition…
About APICAL 300AF021是一种热固性聚酰亚胺材料,。 该产品在北美洲有供货,。 APICAL 300AF021的主要特性有: 阻燃/额定火焰 Flame Retardant 耐化学品 耐潮性 良好的密封性能 APICAL 300AF021的典型应用领域为:电影&& Product Description Supplier Kaneka Generic PI Material Status Commercial: Active Features Good heat sealing,Flame Characteristics,Moisture resistance,Solvent resistance,V-0 Availabilitys North America Technical Data PHYSICAL Nominal value Unit…
About APICAL 50NP is a PI Film material. It is available in Latin America or North America.&& Product Description Supplier Kaneka Generic PI Material Status Commercial: Active Features Low coefficient of friction Availabilitys North America,Europe Technical Data PHYSICAL Nominal value…
About APICAL 100NP is a PI Film material. It is available in Latin America or North America.&& Product Description Supplier Kaneka Generic PI Material Status Commercial: Active Availabilitys North America,Latin America Technical Data PHYSICAL Nominal value Unit Test method Water…