Celanex® DS30HRLM

About
Celanex DS30HRLM is a non-lubricated, lasermarkable, 30% fiberglass reinforced Polybutylene Terephthalate which has excellent hydrolysis resistance, mechanical properties and processability.&&

Product Description
SupplierCelanese
Genericpolybutylene terephthalate
Material StatusCommercial: Active
FeaturesExcellent Processability,Hydrolysis stability,Laser engraving
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Density1.55g/cm³ISO 1183
Shrinkage rate
TD0.70 to 0.90%
MD0.30 to 0.50%
Water absorption rate
Equilibrium, 23 ℃, 50% RH0.15%ISO 62

MECHANICALNominal valueUnitTest method
Tensile modulus9200MPaISO 527-2/1A
tensile strength
fracture135MPaISO 527-2/1A/5
Tensile strain
fracture2.7%ISO 527-2/1A/5
Bending modulus
23℃8900MPaISO 178
bending strength
23℃210MPaISO 178

IMPACTNominal valueUnitTest method
Charpy Notched Impact Strength
23℃6.5kJ/m²ISO 179/1eA
Charpy Unnotch Impact strength
-30℃45kJ/m²
23℃46kJ/m²
Impact strength of cantilever beam notch
23℃7.0kJ/m²ISO 180-1A
Notched impact strength of cantilever beam
23℃35kJ/m²ISO 180/1U

THERMALNominal valueUnitTest method
Hot deformation temperature
0.45 MPa, unannealed225ISO 75-2/B
1.8 MPa, unannealed208ISO 75-2/A
Glass transition temperature60.0ISO 11357-2
Vicat Softening Temp
B50220ISO 306
Melting temperature225ISO 11357-3
Linear coefficient of thermal expansion
MD2.5E-51/℃
TD1.0E-41/℃

Electrical performanceNominal valueUnitTest method
Surface resistivity> 1.0E+15ohmsIEC 60093
Volume resistivity> 1.0E+15ohms·cmIEC 60093
Dielectric strength31kV/mmIEC 60243-1
Relative permittivity
100 Hz4.50 
1 MHz4.10 
Dissipation factor
100 Hz2.2E-3 
1 MHz0.016 
Compared to the leakage tracing index425VIEC 60112

Process Conditions
injectionNominal valueUnitTest method
Drying temperature121°C
Drying time4.0hr
Proposed maximum recycled material ratio25%
Barrel rear temperature230 to 240°C
Barrel middle temperature235 to 250°C
Barrel front temperature240 to 260°C
Nozzle temperature250 to 260°C
Processing (melt) temperature235 to 265°C
Mold temperature65 to 93°C
Injection speed快速 
Back pressure0.00 to 0.345MPa

Notes
1. Typical properties: these are not to be construed as specifications.
2. 10°C/min
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