| About |
|---|
| COMPOCERAN H900 (Polyamideimide Silica Hybrid) Base Resin Medium Mw Polyamideimide Characteristics Heat resistance High elastic modulus Suitable for making film&& |
| Product Description | |
|---|---|
| Generic | PAI |
| Material Status | Commercial: Active |
| Features | Heat Resistance, Good |
| Availabilitys | Asia Pacific |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| functional group | |||
| Silica | 4.00 | ||
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| SiO2 content | 2.0 | wt% | |
| solvent | DMAc |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Solid content | 30 | % | |
| viscosity | |||
| 25℃ | 4.0 | Pa·s |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
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