CONAP® CE-2290

About
CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The product is on the qualified products list (QPL) for MIL-I-46058C and is approved to the IPC-CC-830B for Type AR coatings. The solvent portion of CONAP CE-2290 is an EPA-approved SNAP composition containing no ozone depleting chemicals. It is non-carcinogenic, contains no HAPs and is non- SARA reportable. CONAP CE-2290 is designed for thin-film applications on components and printed circuitry. It provides fast drying times, reparability, outstanding humidity resistance and hydrolytic stability. CONAP CE-2290 has outstanding electrical properties and retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Component removal is possible by melting through the coating with a soldering iron. Removal of the entire coating is possible with a suitable solvent. CONAP CE-2290 incorporates a tracer dye to aid inspection under ultraviolet light.&&

About

CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The product is on the qualified products list (QPL) for MIL-I-46058C and is approved to the IPC-CC-830B for Type AR coatings. The solvent portion of CONAP CE-2290 is an EPA-approved SNAP composition containing no ozone depleting chemicals. It is non-carcinogenic, contains no HAPs and is non- SARA reportable. CONAP CE-2290 is designed for thin-film applications on components and printed circuitry. It provides fast drying times, reparability, outstanding humidity resistance and hydrolytic stability. CONAP CE-2290 has outstanding electrical properties and retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Component removal is possible by melting through the coating with a soldering iron. Removal of the entire coating is possible with a suitable solvent. CONAP CE-2290 incorporates a tracer dye to aid inspection under ultraviolet light.&&

Product Description
Supplier	Cytec Industries
Generic	SMMA
Material Status	Commercial: Negative
Features	Good flexibility,Good Electrical Properties,Hydrolysis stability,Good bond,Moisture resistance
Availabilitys	North America

Technical Data
PHYSICAL	Nominal value	Unit	Test method
Density	0.940	g/cm³
Solid content	28	%
viscosity
25℃	0.35	Pa·s	Brookfield

Electrical performance	Nominal value	Unit
Volume resistivity
25 ℃	2.5E+15	ohms·cm
Dielectric strength	> 120	kV/mm
Dielectric constant
25 ℃，100 Hz	2.50 to 3.00
Dissipation factor
25℃，14 kHz	0.014
insulation resistance
25℃，0.0508 mm	2.8E+12	ohms

Notes
1. Typical properties: these are not to be construed as specifications.
2. After conditioning 24 hours @ 25°C and 50% R.H.
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