| About |
|---|
| CONAP EN-5330 is halogen free based on IEC 61249-2-21 CONAP EN-5330 is a filled two-component polyurethane system designed for use as a potting and encapsulating material for electronic components where critical thermal cycling characteristics are a factor. CONAP EN-5330 has excellent electrical properties, low shrinkage, low stress build-up, and can be hand mixed or machine dispensed.&& |
| Product Description | |
|---|---|
| Supplier | Cytec Industries |
| Generic | PUR |
| Material Status | Commercial: Negative |
| Features | Good Electrical Properties,Low contractility,Good thermal shock resistance,V-0 |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | |||
| — | 1.21 | g/cm³ | |
| — | 1.52 | g/cm³ | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 52 |
| elastic body | Nominal value | Unit | Test method |
|---|---|---|---|
| tensile strength | 6.89 | MPa | |
| Tensile strain | |||
| fracture | 57 | % | |
| tear strength | 22.8 | kN/m |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Surface resistivity | 3.5E+15 | ohms | |
| Volume resistivity | |||
| 25 ℃ | 3.1E+14 | ohms·cm | |
| Dielectric strength | 21 | kV/mm | |
| Dielectric constant | |||
| 25 ℃，1 MHz | 3.60 | ||
| Dissipation factor | |||
| 25℃，1 MHz | 0.025 |
| FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
|---|---|---|---|
| 6.00 mm | V-0 | UL 94 |
| Thermosetting mixed viscosity | Nominal value | Unit | Test method |
|---|---|---|---|
| 25℃ | 5000 | cP |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Thermal conductivity coefficient | 0.57 | W/m/K | Internal Method |
| Thermosetting components | |||
| resin | 按重量计算的混合比: 17 | ||
| Hardening method | 按重量计算的混合比: 100 |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Resin |
| 3. Hardener |
| 4. MIL-16923E |
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