| About |
|---|
| CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent “Z” for curing at elevated temperature; Curing Agent “A” for curing at 120°F (49°C); and Curing Agent “DTA” for curing at ambient temperature.&& |
| Product Description | |
|---|---|
| Supplier | Cytec Industries |
| Generic | 胶黏剂 |
| Material Status | Commercial: Active |
| Features | Thixotropic,High Heat Resistance,Good bond,Low density |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 0.600 | g/cm³ | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Tensile modulus | 633 | MPa | |
| compressive strength | |||
| 23℃ | 41.4 | MPa |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Curing cycle | |||
| 49℃ | 16.0 | hr |
| Notes |
|---|
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |
