CORFIL® 615

About
CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent “Z” for curing at elevated temperature; Curing Agent “A” for curing at 120°F (49°C); and Curing Agent “DTA” for curing at ambient temperature.&&

Product Description
SupplierCytec Industries
Generic胶黏剂
Material StatusCommercial: Active
FeaturesThixotropic,High Heat Resistance,Good bond,Low density
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density0.600g/cm³

MECHANICALNominal valueUnitTest method
Tensile modulus633MPa
compressive strength
23℃41.4MPa

Supplementary informationNominal valueUnitTest method
Curing cycle
49℃16.0hr

Notes
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