| About |
|---|
| CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications. FEATURES & BENEFITS One-part pumpable material 250°F (121°C)/ 350°F (177°C) cure Minimal exotherm -67 to 350°F (-55 to 177°C) service range&& |
| Product Description | |
|---|---|
| Supplier | Cytec Industries |
| Generic | 胶黏剂 |
| Material Status | Commercial: Active |
| Features | Low Viscosity,Thixotropic |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| MECHANICAL | Nominal value | Unit | Test method |
| compressive strength | |||
| 24℃ | 20.7 to 21.4 | MPa | |
| shear strength | |||
| 24℃ | 6.89 to 8.27 | MPa | |
| Notes |
|---|
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |
