Devcon Plastic Steel Putty (A)

About
A steel-filled epoxy putty that cures at room temperature and is designed for filling, rebuilding, and bonding metal surfaces. Intended Use: Patching and repairing areas where welding or brazing would be undesirable or impossible Product features: Applies easily to vertical surfaces Machinable to metallic finish Bonds to aluminum, concrete, and many other metals Resistant to chemicals and most acids, bases, solvents, and alkalis&&

Product Description
SupplierDevcon
Generic环氧树脂
Material StatusCommercial: Active
FeaturesAlkali resistant,Machinable,Acidproof,Solvent resistance,Agglomerability
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density2.33g/cm³
Specific volume0.430cm³/g
Shrinkage rate
MD0.060%ASTM D2566
Solid content
by Volume100%

Electrical performanceNominal valueUnitTest method
Dielectric strength1.2kV/mmASTM D149
Dielectric constant67.5 ASTM D150

Supplementary informationNominal valueUnitTest method
Heat resistant temperature 
Dry121
Wet49
Tensile shear strength19.3MPaASTM D1002

Uncured PropertiesNominal valueUnitTest method
Curing time16hr

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D85 ASTM D2240
Tensile modulus5860MPaASTM D638
bending strength38.6MPaASTM D790
compressive strength57.0MPaASTM D695

THERMALNominal valueUnitTest method
Linear coefficient of thermal expansion
MD8.6E-51/℃ASTM D696
Thermal conductivity coefficient0.57W/m/KASTM C177
Thermosetting components 
Component A按容量计算的混合比: 2.5 按重量计算的混合比: 9.0 
Component B按容量计算的混合比: 1.0 按重量计算的混合比: 1.0 
storage stability
24 ℃45min

Notes
1. Typical properties: these are not to be construed as specifications.
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