EMERGE™ PC/ABS 7380

About
EMERGE PC/ABS 7380 advanced resin is a high flow and high toughness PC/ABS alloy. The property of EMERGE PC/ABS 7380 is specially designed with balanced toughness, tensile elongation and flexure modulus. This grade is designed for thin wall application with high heat and high mechanical strength needs. Applications: Mobile phone Keycaps Tablets and portable devices&&

Product Description
SupplierTrinseo
GenericPC+ABS
Material StatusCommercial: Active
FeaturesGood Rigidity,Good flexibility,High liquidity,High Heat Resistance,HB
AvailabilitysAsia Pacific,Europe
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.18g/cm³ASTM D792
Melt Flow Rate ASTM D1238
230℃,3.80kg4.0g/10minASTM D1238
260℃,5.0kg24g/10minASTM D1238
Shrinkage rate
MD0.40 to 0.60%ASTM D955

MECHANICALNominal valueUnitTest method
tensile strength
Yield, 3.20 mm, injection molding54.0MPaASTM D638
Tensile strain
Fracture, 3.20 mm, injection molded130%ASTM D638
Bending modulus
3.20 mm, injection molded2600MPaASTM D790
bending strength
3.20 mm, injection molded87.0MPaASTM D790

IMPACTNominal valueUnitTest method
Impact strength of cantilever beam notch
23 ℃, 3.2mm, injection molding730J/mASTM D256

THERMALNominal valueUnitTest method
Hot deformation temperature ASTM D648
0.45 MPa, unannealed120ASTM D648
1.8 MPa, unannealed105ASTM D648
Relative temperature index60.0UL 746
Electrical performance60.0UL 746
Impact mechanical performance60.0UL 746

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level UL 94
1.00 mmHB UL 94
3.20 mmHB UL 94

Process Conditions
injectionNominal valueUnitTest method
Drying temperature80°C
Drying time4.0 to 6.0hr
Processing (melt) temperature230 to 280°C
Mold temperature60 to 90°C

Notes
1. Typical properties: these are not to be construed as specifications.
2. This rating not intended to reflect hazards presented by this or any other material under actual fire conditions.
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