EMPILON® HA363

About
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.&&

Product Description
SupplierEMPILON
GenericSEBS
Material StatusCommercial: Active
FeaturesRenewable resources,Hydrolysis stability,Halogen free,No antimony,Block Copolymer,Lead content is low to none,Nontoxicity,Low to no calcium content
AvailabilitysAsia Pacific
Process MethodsInjection Molding

Technical Data
PHYSICALNominal valueUnitTest method
Density1.05g/cm³ASTM D792
Melt Flow Rate
200℃,5.0kg3.0g/10minASTM D1238
Shrinkage rate 
MD1.7%
TD1.5%

MECHANICALNominal valueUnitTest method
Shore hardness
Shore A, 10 seconds61 ASTM D2240

elastic bodyNominal valueUnitTest method
tensile strength3.53MPaASTM D412
Tensile strain
fracture500%ASTM D412

THERMALNominal valueUnitTest method
Embrittlement temperature-40.0

Supplementary informationNominal valueUnitTest method
Adhesion to ABS7.00kgf/25 mmInternal Method
Adhesion to PC6.00kgf/25 mmInternal Method

Notes
1. Typical properties: these are not to be construed as specifications.
2. Reference Only
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