About |
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Epic R1055/H5083 is a vacuum grade modified epoxy system designed to achieve penetration of tightly wound electrical coils. The system cures at ambient temperatures thereby affording the user the opportunity to reduce substantial energy costs normally associated with heat curing systems. R1055/H5083 features a good combination of physical and electrical properties that qualify the compound for potting high voltage power supplies. R1055/H5083 is appropriate for devices with hot spot temperatures up to 140C. This system is UL 94 HB recognized at 1.5mm.&& |
Product Description | |
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Generic | 环氧树脂 |
Material Status | Commercial: Active |
Features | Good Electrical Properties |
Availabilitys | North America |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.45 to 1.50 | g/cm³ | ASTM D792 |
MECHANICAL | Nominal value | Unit | Test method |
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Shore hardness | |||
Shaw’s D, 25 ℃ | 83 to 87 | ASTM D2240 |
Electrical performance | Nominal value | Unit | Test method |
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Volume resistivity | 1.9E+15 to 2.1E+15 | ohms·cm | ASTM D257 |
Dielectric strength | |||
2.03 mm | 21 to 23 | kV/mm | ASTM D149 |
Dielectric constant | |||
100 kHz | 3.61 to 3.99 | ASTM D2520 | |
Dissipation factor | |||
100 kHz | 0.014 to 0.015 | ASTM D150 |
Thermosetting mixed viscosity | Nominal value | Unit | Test method |
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25℃ | 2000 to 3000 | cP | ASTM D2393 |
THERMAL | Nominal value | Unit | Test method |
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Glass transition temperature | 76.0 to 84.0 | ℃ | ASTM E1356 |
Linear coefficient of thermal expansion | |||
MD | 4.3E-5 to 4.7E-5 | 1/℃ | ASTM D696 |
Thermosetting components | |||
resin | 按重量计算的混合比: 100 按容量计算的混合比: 3.3 | ||
Hardening method | 按重量计算的混合比: 18 按容量计算的混合比: 1.0 | ||
storage stability | |||
25 ℃ | 180 to 240 | min |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
2. 200 Gram Mass |
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