EPO-TEK® 301

About
EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesLow Viscosity,Biocompatible,High pressure disinfection,Low odor,Good bond,Radiation disinfection,Nontoxicity,Ethylene oxide disinfection
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
optical performanceNominal valueUnitTest method
Refractive index 
23℃,589 nm1.519
Transmittance 
380-980 nm> 99.0%
980-1640 nm> 97.0%
1640-2040 nm> 95.0%

Supplementary informationNominal valueUnitTest method
Degradation Temperature430TGA
Die Shear Strength(>10 kg,23℃)23.4MPa
working temperature 
Continuous-55 to 200
Intermittent-55 to 300
Storage Modulus(23℃)2.26GPa
Heating reduction 
200℃0.12%
250℃0.13%
300℃0.39%

Uncured PropertiesNominal valueUnitTest method
colour 
Clear/Transparent 
Density 
Part B0.868g/cm³
Part A1.15g/cm³
viscosity
23℃0.10 to 0.20Pa·s
Curing time
65℃2.0hr
storage stability60 to 120min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D85 
lap shear strength
23℃> 13.8MPa
Relative permittivity
1 kHz4.00 
Volume resistivity
23℃> 1.0E+13ohms·cm
Dissipation factor
1 kHz0.016 

THERMALNominal valueUnitTest method
3.9E-5cm/cm/℃
9.8E-5cm/cm/℃
Glass transition temperature> 65.0
Linear coefficient of thermal expansion
MD 
Thermosetting components 
Component A按重量计算的混合比: 20 
Component B按重量计算的混合比: 5.0 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 589 nm
6. Part B
7. Part A
8. 100 rpm
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