EPO-TEK® 314

About
A two component, high temperature grade, thermally and electrically insulating epoxy, designed for adhesive and sealing applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low viscosity, optical grade epoxy with low index of refraction (Nd).&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesThermal insulation,Low Viscosity,High Heat Resistance,Insulation
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
optical performanceNominal valueUnitTest method
Refractive index1.497 
Transmittance
440-1680 nm> 96.0%

Supplementary informationNominal valueUnitTest method
Degradation Temperature361
Die Shear Strength(>15 kg,23℃)35.2MPa
working temperature 
Continuous-55 to 200
Intermittent-55 to 300
Storage Modulus(23℃)1.90GPa
Heating reduction 
200℃0.18%
250℃0.43%
300℃1.0%

Uncured PropertiesNominal valueUnitTest method
colour 
Amber 
Clear/Transparent 
Density 
Part A1.18g/cm³
Part B1.23g/cm³
viscosity
23℃0.30 to 0.60Pa·s
Curing time
150℃1.0hr
storage stability5800min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D83 
Relative permittivity
1 kHz3.25 
Volume resistivity
23℃> 1.0E+13ohms·cm
Dissipation factor
1 kHz0.013 

THERMALNominal valueUnitTest method
3.9E-5cm/cm/℃
1.3E-4cm/cm/℃
Glass transition temperature> 75.0
Linear coefficient of thermal expansion
MD 
Thermosetting components 
Component A按重量计算的混合比: 100 
Component B按重量计算的混合比: 6.0 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 589 nm
6. Part B
7. Part A
8. 100 rpm
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